SEMICONDUCTOR DEVICE MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To reduce loss of a resin material for forming an insulation film and form a pattern with high accuracy.SOLUTION: A semiconductor device manufacturing method including a formation process of an insulation film for a protection film, an encapsulation film and the like comprises...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MIYAMOTO TSUTOMU, SEKITA NOBUATSU, KANEKO NORIHIKO, KONO ICHIRO
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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