DEVICE OF PASTING PROTECTIVE TAPE TO WAFER AND METHOD OF MANUFACTURING WAFER
PROBLEM TO BE SOLVED: To provide a device of pasting a protective tape to a wafer so as to efficiently seal the peripheral end of the wafer, and to provide a method of manufacturing a wafer to which a protective tape is pasted.SOLUTION: A device of pasting a protective tape to a wafer includes a pro...
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| creator | KIYOKAWA HAJIME KITAMURA KOICHI FUJITANI KAZUYA IBE TAKASHI IGUCHI FUMIAKI TANIGAWA SHIGEKI |
| description | PROBLEM TO BE SOLVED: To provide a device of pasting a protective tape to a wafer so as to efficiently seal the peripheral end of the wafer, and to provide a method of manufacturing a wafer to which a protective tape is pasted.SOLUTION: A device of pasting a protective tape to a wafer includes a protective tape pasting section (d) for pasting a protective tape A, having an external diameter larger than that of a wafer W, to the rear surface of the wafer W so as to project from the peripheral end of the wafer W, and an end sealing section (i) for pasting a protective tape B, having an external diameter larger than that of the wafer W, to the surface of the wafer W to which the protective tape A is pasted in the protective tape A pasting section, so as to project from the peripheral end of the wafer W, integrating the peripheral end of the protective tape A and the peripheral end of the protective tape B, and sealing the peripheral end of the wafer W.
【課題】ウエハの周端部を効率よく封止することができるウエハへの保護テープの貼付装置および保護テープが貼付されたウエハの製造方法を提供する。【解決手段】ウエハＷの外径よりも大きい外径を有する保護テープＡを当該ウエハＷの周端部から保護テープＡが突出するようにウエハＷの裏面に貼付するための保護テープＡの貼り付け部ｄと、前記保護テープＡの貼り付け部で保護テープＡが貼付されたウエハＷの表面に当該ウエハＷの外径よりも大きい外径を有する保護テープＢを当該ウエハＷの周端部から突出させて貼付し、保護テープＡの周端部と保護テープＢの周端部とを一体化させ、ウエハＷの周端部を封止するための端部封止部ｉを備えていることを特徴とする。【選択図】図２ |
| format | Patent |
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【課題】ウエハの周端部を効率よく封止することができるウエハへの保護テープの貼付装置および保護テープが貼付されたウエハの製造方法を提供する。【解決手段】ウエハＷの外径よりも大きい外径を有する保護テープＡを当該ウエハＷの周端部から保護テープＡが突出するようにウエハＷの裏面に貼付するための保護テープＡの貼り付け部ｄと、前記保護テープＡの貼り付け部で保護テープＡが貼付されたウエハＷの表面に当該ウエハＷの外径よりも大きい外径を有する保護テープＢを当該ウエハＷの周端部から突出させて貼付し、保護テープＡの周端部と保護テープＢの周端部とを一体化させ、ウエハＷの周端部を封止するための端部封止部ｉを備えていることを特徴とする。【選択図】図２</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150907&DB=EPODOC&CC=JP&NR=2015162634A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150907&DB=EPODOC&CC=JP&NR=2015162634A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIYOKAWA HAJIME</creatorcontrib><creatorcontrib>KITAMURA KOICHI</creatorcontrib><creatorcontrib>FUJITANI KAZUYA</creatorcontrib><creatorcontrib>IBE TAKASHI</creatorcontrib><creatorcontrib>IGUCHI FUMIAKI</creatorcontrib><creatorcontrib>TANIGAWA SHIGEKI</creatorcontrib><title>DEVICE OF PASTING PROTECTIVE TAPE TO WAFER AND METHOD OF MANUFACTURING WAFER</title><description>PROBLEM TO BE SOLVED: To provide a device of pasting a protective tape to a wafer so as to efficiently seal the peripheral end of the wafer, and to provide a method of manufacturing a wafer to which a protective tape is pasted.SOLUTION: A device of pasting a protective tape to a wafer includes a protective tape pasting section (d) for pasting a protective tape A, having an external diameter larger than that of a wafer W, to the rear surface of the wafer W so as to project from the peripheral end of the wafer W, and an end sealing section (i) for pasting a protective tape B, having an external diameter larger than that of the wafer W, to the surface of the wafer W to which the protective tape A is pasted in the protective tape A pasting section, so as to project from the peripheral end of the wafer W, integrating the peripheral end of the protective tape A and the peripheral end of the protective tape B, and sealing the peripheral end of the wafer W.
【課題】ウエハの周端部を効率よく封止することができるウエハへの保護テープの貼付装置および保護テープが貼付されたウエハの製造方法を提供する。【解決手段】ウエハＷの外径よりも大きい外径を有する保護テープＡを当該ウエハＷの周端部から保護テープＡが突出するようにウエハＷの裏面に貼付するための保護テープＡの貼り付け部ｄと、前記保護テープＡの貼り付け部で保護テープＡが貼付されたウエハＷの表面に当該ウエハＷの外径よりも大きい外径を有する保護テープＢを当該ウエハＷの周端部から突出させて貼付し、保護テープＡの周端部と保護テープＢの周端部とを一体化させ、ウエハＷの周端部を封止するための端部封止部ｉを備えていることを特徴とする。【選択図】図２</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPBxcQ3zdHZV8HdTCHAMDvH0c1cICPIPcXUO8QxzVQhxDAAS_grhjm6uQQqOfi4Kvq4hHv4uIOW-jn6hbo7OIaFBIE1gFTwMrGmJOcWpvFCam0HJzTXE2UM3tSA_PrW4IDE5NS-1JN4rwMjA0NTQzMjM2MTRmChFAO4pLhc</recordid><startdate>20150907</startdate><enddate>20150907</enddate><creator>KIYOKAWA HAJIME</creator><creator>KITAMURA KOICHI</creator><creator>FUJITANI KAZUYA</creator><creator>IBE TAKASHI</creator><creator>IGUCHI FUMIAKI</creator><creator>TANIGAWA SHIGEKI</creator><scope>EVB</scope></search><sort><creationdate>20150907</creationdate><title>DEVICE OF PASTING PROTECTIVE TAPE TO WAFER AND METHOD OF MANUFACTURING WAFER</title><author>KIYOKAWA HAJIME ; KITAMURA KOICHI ; FUJITANI KAZUYA ; IBE TAKASHI ; IGUCHI FUMIAKI ; TANIGAWA SHIGEKI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2015162634A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KIYOKAWA HAJIME</creatorcontrib><creatorcontrib>KITAMURA KOICHI</creatorcontrib><creatorcontrib>FUJITANI KAZUYA</creatorcontrib><creatorcontrib>IBE TAKASHI</creatorcontrib><creatorcontrib>IGUCHI FUMIAKI</creatorcontrib><creatorcontrib>TANIGAWA SHIGEKI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIYOKAWA HAJIME</au><au>KITAMURA KOICHI</au><au>FUJITANI KAZUYA</au><au>IBE TAKASHI</au><au>IGUCHI FUMIAKI</au><au>TANIGAWA SHIGEKI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>DEVICE OF PASTING PROTECTIVE TAPE TO WAFER AND METHOD OF MANUFACTURING WAFER</title><date>2015-09-07</date><risdate>2015</risdate><abstract>PROBLEM TO BE SOLVED: To provide a device of pasting a protective tape to a wafer so as to efficiently seal the peripheral end of the wafer, and to provide a method of manufacturing a wafer to which a protective tape is pasted.SOLUTION: A device of pasting a protective tape to a wafer includes a protective tape pasting section (d) for pasting a protective tape A, having an external diameter larger than that of a wafer W, to the rear surface of the wafer W so as to project from the peripheral end of the wafer W, and an end sealing section (i) for pasting a protective tape B, having an external diameter larger than that of the wafer W, to the surface of the wafer W to which the protective tape A is pasted in the protective tape A pasting section, so as to project from the peripheral end of the wafer W, integrating the peripheral end of the protective tape A and the peripheral end of the protective tape B, and sealing the peripheral end of the wafer W.
【課題】ウエハの周端部を効率よく封止することができるウエハへの保護テープの貼付装置および保護テープが貼付されたウエハの製造方法を提供する。【解決手段】ウエハＷの外径よりも大きい外径を有する保護テープＡを当該ウエハＷの周端部から保護テープＡが突出するようにウエハＷの裏面に貼付するための保護テープＡの貼り付け部ｄと、前記保護テープＡの貼り付け部で保護テープＡが貼付されたウエハＷの表面に当該ウエハＷの外径よりも大きい外径を有する保護テープＢを当該ウエハＷの周端部から突出させて貼付し、保護テープＡの周端部と保護テープＢの周端部とを一体化させ、ウエハＷの周端部を封止するための端部封止部ｉを備えていることを特徴とする。【選択図】図２</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | DEVICE OF PASTING PROTECTIVE TAPE TO WAFER AND METHOD OF MANUFACTURING WAFER |
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