THERMAL STORAGE DEVICE, STRUCTURE AND PROCESS OF MANUFACTURE OF THERMAL STORAGE DEVICE

PROBLEM TO BE SOLVED: To perform a positive encapsulation of a place where a phase change material is flowed in after the phase change material is flowed in.SOLUTION: A thermal storage panel 1 of this invention comprises a front plate 11 that is a member heat exchanged with outside part, a frame bod...

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Hauptverfasser: TOTANI TAKESHI, YAMAGUCHI KOJI, YAMADA KOHEI, NAGANO HOSEI
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creator TOTANI TAKESHI
YAMAGUCHI KOJI
YAMADA KOHEI
NAGANO HOSEI
description PROBLEM TO BE SOLVED: To perform a positive encapsulation of a place where a phase change material is flowed in after the phase change material is flowed in.SOLUTION: A thermal storage panel 1 of this invention comprises a front plate 11 that is a member heat exchanged with outside part, a frame body 13 and a rear plate 17 forming storing spaces 139 among the front plate 11 and the frame body 13 and the rear plate 17, and phase change material stored in the storing spaces 139 and showing phase change by heat exchanged with the outside. Further, this thermal storage panel 1 has a through-pass hole 138 arranged at the frame body 13, a first through-pass hole 138A and a second through-pass hole 138B for guiding the phase change material pored from outside into the storing spaces 139 and sealed after this guiding action, and a third through-pass hole 138C and a fourth through-pass hole 138D for discharging air in the storing spaces 139 to the outside when the phase change material flows into the storing spaces 139 through the first through-pass hole 138A and the second through-pass hole 138B and sealed after this discharging action. 【課題】相変化材を流入させる箇所を相変化材の流入後に確実に封止する。【解決手段】本発明の蓄熱パネル1は、外部と熱交換する部材である表板11と、表板11との間に収容空間139を形成する枠体13および裏板17と、収容空間139に収容され外部と交換される熱により相変化する相変化材とを備える。さらに、この蓄熱パネル1は、枠体13に設けられる貫通孔138であり、外部から収容空間139内に注入される相変化材を案内し、この案内後に封止される第1貫通孔138Aおよび第2貫通孔138Bと、第1貫通孔138Aおよび第2貫通孔138Bを介して収容空間139内に相変化材が流入する際、収容空間139内の空気を外部へ排出し、この排出後に封止される第3貫通孔138Cおよび第4貫通孔138Dとを備える。【選択図】図2
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Further, this thermal storage panel 1 has a through-pass hole 138 arranged at the frame body 13, a first through-pass hole 138A and a second through-pass hole 138B for guiding the phase change material pored from outside into the storing spaces 139 and sealed after this guiding action, and a third through-pass hole 138C and a fourth through-pass hole 138D for discharging air in the storing spaces 139 to the outside when the phase change material flows into the storing spaces 139 through the first through-pass hole 138A and the second through-pass hole 138B and sealed after this discharging action. 【課題】相変化材を流入させる箇所を相変化材の流入後に確実に封止する。【解決手段】本発明の蓄熱パネル1は、外部と熱交換する部材である表板11と、表板11との間に収容空間139を形成する枠体13および裏板17と、収容空間139に収容され外部と交換される熱により相変化する相変化材とを備える。さらに、この蓄熱パネル1は、枠体13に設けられる貫通孔138であり、外部から収容空間139内に注入される相変化材を案内し、この案内後に封止される第1貫通孔138Aおよび第2貫通孔138Bと、第1貫通孔138Aおよび第2貫通孔138Bを介して収容空間139内に相変化材が流入する際、収容空間139内の空気を外部へ排出し、この排出後に封止される第3貫通孔138Cおよび第4貫通孔138Dとを備える。【選択図】図2</description><subject>ADHESIVES</subject><subject>BLASTING</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</subject><subject>MECHANICAL ENGINEERING</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZAgL8XAN8nX0UQgO8Q9ydHdVcHEN83R21QHyg0KdQ0KDXBUc_VwUAoL8nV2DgxX83RR8Hf1C3RwhUkAudv08DKxpiTnFqbxQmptByc01xNlDN7UgPz61uCAxOTUvtSTeK8DIwNDU0MTA0sLc0ZgoRQDojzET</recordid><startdate>20150803</startdate><enddate>20150803</enddate><creator>TOTANI TAKESHI</creator><creator>YAMAGUCHI KOJI</creator><creator>YAMADA KOHEI</creator><creator>NAGANO HOSEI</creator><scope>EVB</scope></search><sort><creationdate>20150803</creationdate><title>THERMAL STORAGE DEVICE, STRUCTURE AND PROCESS OF MANUFACTURE OF THERMAL STORAGE DEVICE</title><author>TOTANI TAKESHI ; YAMAGUCHI KOJI ; YAMADA KOHEI ; NAGANO HOSEI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2015140987A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2015</creationdate><topic>ADHESIVES</topic><topic>BLASTING</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE</topic><topic>MECHANICAL ENGINEERING</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>TOTANI TAKESHI</creatorcontrib><creatorcontrib>YAMAGUCHI KOJI</creatorcontrib><creatorcontrib>YAMADA KOHEI</creatorcontrib><creatorcontrib>NAGANO HOSEI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TOTANI TAKESHI</au><au>YAMAGUCHI KOJI</au><au>YAMADA KOHEI</au><au>NAGANO HOSEI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>THERMAL STORAGE DEVICE, STRUCTURE AND PROCESS OF MANUFACTURE OF THERMAL STORAGE DEVICE</title><date>2015-08-03</date><risdate>2015</risdate><abstract>PROBLEM TO BE SOLVED: To perform a positive encapsulation of a place where a phase change material is flowed in after the phase change material is flowed in.SOLUTION: A thermal storage panel 1 of this invention comprises a front plate 11 that is a member heat exchanged with outside part, a frame body 13 and a rear plate 17 forming storing spaces 139 among the front plate 11 and the frame body 13 and the rear plate 17, and phase change material stored in the storing spaces 139 and showing phase change by heat exchanged with the outside. Further, this thermal storage panel 1 has a through-pass hole 138 arranged at the frame body 13, a first through-pass hole 138A and a second through-pass hole 138B for guiding the phase change material pored from outside into the storing spaces 139 and sealed after this guiding action, and a third through-pass hole 138C and a fourth through-pass hole 138D for discharging air in the storing spaces 139 to the outside when the phase change material flows into the storing spaces 139 through the first through-pass hole 138A and the second through-pass hole 138B and sealed after this discharging action. 【課題】相変化材を流入させる箇所を相変化材の流入後に確実に封止する。【解決手段】本発明の蓄熱パネル1は、外部と熱交換する部材である表板11と、表板11との間に収容空間139を形成する枠体13および裏板17と、収容空間139に収容され外部と交換される熱により相変化する相変化材とを備える。さらに、この蓄熱パネル1は、枠体13に設けられる貫通孔138であり、外部から収容空間139内に注入される相変化材を案内し、この案内後に封止される第1貫通孔138Aおよび第2貫通孔138Bと、第1貫通孔138Aおよび第2貫通孔138Bを介して収容空間139内に相変化材が流入する際、収容空間139内の空気を外部へ排出し、この排出後に封止される第3貫通孔138Cおよび第4貫通孔138Dとを備える。【選択図】図2</abstract><oa>free_for_read</oa></addata></record>
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subjects ADHESIVES
BLASTING
CHEMISTRY
DYES
HEAT EXCHANGE IN GENERAL
HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
HEATING
LIGHTING
MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FORELSEWHERE
MECHANICAL ENGINEERING
METALLURGY
MISCELLANEOUS APPLICATIONS OF MATERIALS
MISCELLANEOUS COMPOSITIONS
NATURAL RESINS
PAINTS
POLISHES
WEAPONS
title THERMAL STORAGE DEVICE, STRUCTURE AND PROCESS OF MANUFACTURE OF THERMAL STORAGE DEVICE
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