SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING SYSTEM AND STORAGE MEDIUM
PROBLEM TO BE SOLVED: To provide a substrate cleaning method arranged so that an undesired small-particle size substance attached to a substrate can be removed without affecting the surface of a substrate.SOLUTION: A substrate cleaning method according to an embodiment of the present invention compr...
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| creator | AIHARA AKINORI TANAKA AKIRA KANEKO MIYAKO SUGANO ITARU TAUCHI HIROSHI ORII TAKEHIKO |
| description | PROBLEM TO BE SOLVED: To provide a substrate cleaning method arranged so that an undesired small-particle size substance attached to a substrate can be removed without affecting the surface of a substrate.SOLUTION: A substrate cleaning method according to an embodiment of the present invention comprises: a film-forming process liquid supplying step; a stripping process liquid supplying step; and a dissolving process liquid supplying step. In the film-forming process liquid supplying step, a film-forming process liquid including a volatile component and used for forming a film on a substrate is supplied onto the substrate. In the stripping process liquid supplying step, a stripping process liquid for stripping, from the substrate, a process film formed by volatilizing the volatile component and consequently solidifying or curing the film-forming process liquid on the substrate is supplied to the process film. In the dissolving process liquid supplying step, a dissolving process liquid for dissolving the process film is supplied to the process film after the stripping process liquid supplying step.
【課題】基板の表面に影響を与えることなく、基板に付着した粒子径の小さい不要物を除去すること。【解決手段】実施形態に係る基板洗浄方法は、成膜処理液供給工程と、剥離処理液供給工程と、溶解処理液供給工程とを含む。成膜処理液供給工程は、揮発成分を含み基板上に膜を形成するための成膜処理液を基板へ供給する。剥離処理液供給工程は、揮発成分が揮発することによって成膜処理液が基板上で固化または硬化してなる処理膜に対し、処理膜を基板から剥離させる剥離処理液を供給する。溶解処理液供給工程は、剥離処理液供給工程後、処理膜に対し、処理膜を溶解させる溶解処理液を供給する。【選択図】図４ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2015119164A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2015119164A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2015119164A3</originalsourceid><addsrcrecordid>eNrjZHAPDnUKDglyDHFVcPZxdfTz9HNX8HUN8fB30VHAIhUcGRzi6qvg6OeiEBziH-To7gpU7eIZ6svDwJqWmFOcyguluRmU3FxDnD10Uwvy41OLCxKTU_NSS-K9AowMDE0NDS0NzUwcjYlSBABAji0V</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING SYSTEM AND STORAGE MEDIUM</title><source>esp@cenet</source><creator>AIHARA AKINORI ; TANAKA AKIRA ; KANEKO MIYAKO ; SUGANO ITARU ; TAUCHI HIROSHI ; ORII TAKEHIKO</creator><creatorcontrib>AIHARA AKINORI ; TANAKA AKIRA ; KANEKO MIYAKO ; SUGANO ITARU ; TAUCHI HIROSHI ; ORII TAKEHIKO</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a substrate cleaning method arranged so that an undesired small-particle size substance attached to a substrate can be removed without affecting the surface of a substrate.SOLUTION: A substrate cleaning method according to an embodiment of the present invention comprises: a film-forming process liquid supplying step; a stripping process liquid supplying step; and a dissolving process liquid supplying step. In the film-forming process liquid supplying step, a film-forming process liquid including a volatile component and used for forming a film on a substrate is supplied onto the substrate. In the stripping process liquid supplying step, a stripping process liquid for stripping, from the substrate, a process film formed by volatilizing the volatile component and consequently solidifying or curing the film-forming process liquid on the substrate is supplied to the process film. In the dissolving process liquid supplying step, a dissolving process liquid for dissolving the process film is supplied to the process film after the stripping process liquid supplying step.
【課題】基板の表面に影響を与えることなく、基板に付着した粒子径の小さい不要物を除去すること。【解決手段】実施形態に係る基板洗浄方法は、成膜処理液供給工程と、剥離処理液供給工程と、溶解処理液供給工程とを含む。成膜処理液供給工程は、揮発成分を含み基板上に膜を形成するための成膜処理液を基板へ供給する。剥離処理液供給工程は、揮発成分が揮発することによって成膜処理液が基板上で固化または硬化してなる処理膜に対し、処理膜を基板から剥離させる剥離処理液を供給する。溶解処理液供給工程は、剥離処理液供給工程後、処理膜に対し、処理膜を溶解させる溶解処理液を供給する。【選択図】図４</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150625&DB=EPODOC&CC=JP&NR=2015119164A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150625&DB=EPODOC&CC=JP&NR=2015119164A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AIHARA AKINORI</creatorcontrib><creatorcontrib>TANAKA AKIRA</creatorcontrib><creatorcontrib>KANEKO MIYAKO</creatorcontrib><creatorcontrib>SUGANO ITARU</creatorcontrib><creatorcontrib>TAUCHI HIROSHI</creatorcontrib><creatorcontrib>ORII TAKEHIKO</creatorcontrib><title>SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING SYSTEM AND STORAGE MEDIUM</title><description>PROBLEM TO BE SOLVED: To provide a substrate cleaning method arranged so that an undesired small-particle size substance attached to a substrate can be removed without affecting the surface of a substrate.SOLUTION: A substrate cleaning method according to an embodiment of the present invention comprises: a film-forming process liquid supplying step; a stripping process liquid supplying step; and a dissolving process liquid supplying step. In the film-forming process liquid supplying step, a film-forming process liquid including a volatile component and used for forming a film on a substrate is supplied onto the substrate. In the stripping process liquid supplying step, a stripping process liquid for stripping, from the substrate, a process film formed by volatilizing the volatile component and consequently solidifying or curing the film-forming process liquid on the substrate is supplied to the process film. In the dissolving process liquid supplying step, a dissolving process liquid for dissolving the process film is supplied to the process film after the stripping process liquid supplying step.
【課題】基板の表面に影響を与えることなく、基板に付着した粒子径の小さい不要物を除去すること。【解決手段】実施形態に係る基板洗浄方法は、成膜処理液供給工程と、剥離処理液供給工程と、溶解処理液供給工程とを含む。成膜処理液供給工程は、揮発成分を含み基板上に膜を形成するための成膜処理液を基板へ供給する。剥離処理液供給工程は、揮発成分が揮発することによって成膜処理液が基板上で固化または硬化してなる処理膜に対し、処理膜を基板から剥離させる剥離処理液を供給する。溶解処理液供給工程は、剥離処理液供給工程後、処理膜に対し、処理膜を溶解させる溶解処理液を供給する。【選択図】図４</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHAPDnUKDglyDHFVcPZxdfTz9HNX8HUN8fB30VHAIhUcGRzi6qvg6OeiEBziH-To7gpU7eIZ6svDwJqWmFOcyguluRmU3FxDnD10Uwvy41OLCxKTU_NSS-K9AowMDE0NDS0NzUwcjYlSBABAji0V</recordid><startdate>20150625</startdate><enddate>20150625</enddate><creator>AIHARA AKINORI</creator><creator>TANAKA AKIRA</creator><creator>KANEKO MIYAKO</creator><creator>SUGANO ITARU</creator><creator>TAUCHI HIROSHI</creator><creator>ORII TAKEHIKO</creator><scope>EVB</scope></search><sort><creationdate>20150625</creationdate><title>SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING SYSTEM AND STORAGE MEDIUM</title><author>AIHARA AKINORI ; TANAKA AKIRA ; KANEKO MIYAKO ; SUGANO ITARU ; TAUCHI HIROSHI ; ORII TAKEHIKO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2015119164A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>AIHARA AKINORI</creatorcontrib><creatorcontrib>TANAKA AKIRA</creatorcontrib><creatorcontrib>KANEKO MIYAKO</creatorcontrib><creatorcontrib>SUGANO ITARU</creatorcontrib><creatorcontrib>TAUCHI HIROSHI</creatorcontrib><creatorcontrib>ORII TAKEHIKO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AIHARA AKINORI</au><au>TANAKA AKIRA</au><au>KANEKO MIYAKO</au><au>SUGANO ITARU</au><au>TAUCHI HIROSHI</au><au>ORII TAKEHIKO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING SYSTEM AND STORAGE MEDIUM</title><date>2015-06-25</date><risdate>2015</risdate><abstract>PROBLEM TO BE SOLVED: To provide a substrate cleaning method arranged so that an undesired small-particle size substance attached to a substrate can be removed without affecting the surface of a substrate.SOLUTION: A substrate cleaning method according to an embodiment of the present invention comprises: a film-forming process liquid supplying step; a stripping process liquid supplying step; and a dissolving process liquid supplying step. In the film-forming process liquid supplying step, a film-forming process liquid including a volatile component and used for forming a film on a substrate is supplied onto the substrate. In the stripping process liquid supplying step, a stripping process liquid for stripping, from the substrate, a process film formed by volatilizing the volatile component and consequently solidifying or curing the film-forming process liquid on the substrate is supplied to the process film. In the dissolving process liquid supplying step, a dissolving process liquid for dissolving the process film is supplied to the process film after the stripping process liquid supplying step.
【課題】基板の表面に影響を与えることなく、基板に付着した粒子径の小さい不要物を除去すること。【解決手段】実施形態に係る基板洗浄方法は、成膜処理液供給工程と、剥離処理液供給工程と、溶解処理液供給工程とを含む。成膜処理液供給工程は、揮発成分を含み基板上に膜を形成するための成膜処理液を基板へ供給する。剥離処理液供給工程は、揮発成分が揮発することによって成膜処理液が基板上で固化または硬化してなる処理膜に対し、処理膜を基板から剥離させる剥離処理液を供給する。溶解処理液供給工程は、剥離処理液供給工程後、処理膜に対し、処理膜を溶解させる溶解処理液を供給する。【選択図】図４</abstract><oa>free_for_read</oa></addata></record> |
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| title | SUBSTRATE CLEANING METHOD, SUBSTRATE CLEANING SYSTEM AND STORAGE MEDIUM |
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