CONDUCTIVE PARTICLE, CONDUCTIVE MATERIAL AND CONNECTION STRUCTURE

PROBLEM TO BE SOLVED: To provide a conductive particle capable of making initial connection resistance low when a connection structure is obtained by electrically connecting electrodes by the conductive particle, and capable of maintaining connection resistance low even when the connection structure...

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1. Verfasser: O GYOKA
Format: Patent
Sprache:eng ; jpn
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Zusammenfassung:PROBLEM TO BE SOLVED: To provide a conductive particle capable of making initial connection resistance low when a connection structure is obtained by electrically connecting electrodes by the conductive particle, and capable of maintaining connection resistance low even when the connection structure is exposed in a presence of acid.SOLUTION: The conductive particle 1 has a substrate particle 11, a first conductive layer 12 arranged on a surface of the substrate particle 11 and formed from silver or copper and a second conducive layer 13 arranged on an outside surface of the first conductive layer 12 and formed from nickel, the second conductive layer 13 has a plurality of projections 13a on an outside surface and average height of the projections 13a is larger than thickness of a part having no projections 13a of the second conductive layer 13. 【課題】導電性粒子により電極間を電気的に接続して接続構造体を得た場合に、初期の接続抵抗を低くすることができ、更に接続構造体が酸の存在下に晒されても、接続抵抗を低く維持することができる導電性粒子を提供する。【解決手段】本発明に係る導電性粒子1は、基材粒子11と、基材粒子11の表面上に配置されており、かつ銀又は銅により形成された第1の導電層12と、第1の導電層12の外表面上に配置されており、かつニッケルにより形成された第2の導電層13とを備え、第2の導電層13が外表面に複数の突起13aを有し、突起13aの平均高さが、第2の導電層13の突起13aが無い部分の厚みよりも大きい。【選択図】図1