ADHESIVE COMPOSITION AND ADHESIVE TAPE

PROBLEM TO BE SOLVED: To provide an adhesive tape capable of suppressing a temperature rise and generation of a hot spot on a surface of a housing, allowing very easy attachment to the housing, and having excellent adhesion to the housing, and also provide an electronic component having the adhesive...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MIKI KAORU, HIRAO AKIRA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES
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