ADHESIVE COMPOSITION AND ADHESIVE TAPE
PROBLEM TO BE SOLVED: To provide an adhesive tape capable of suppressing a temperature rise and generation of a hot spot on a surface of a housing, allowing very easy attachment to the housing, and having excellent adhesion to the housing, and also provide an electronic component having the adhesive...
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| creator | MIKI KAORU HIRAO AKIRA |
| description | PROBLEM TO BE SOLVED: To provide an adhesive tape capable of suppressing a temperature rise and generation of a hot spot on a surface of a housing, allowing very easy attachment to the housing, and having excellent adhesion to the housing, and also provide an electronic component having the adhesive tape that has excellent heat discharge properties and assembly workability.SOLUTION: An adhesive tape has a thermal conduction suppression layer and a substrate layer. The thermal conduction suppression layer includes hollow fine particles including a hollow part and a surface layer. The surface layer includes a resin component as a main component. A thermal conduction rate is 0.07 W/m K or lower, measured by a steady state method.
【課題】筐体表面の温度上昇およびホットスポットの発生を抑制することができ、さらに、筐体への取り付け作業がきわめて容易で、かつ、筐体への密着性に優れる粘着テープを提供する。また、そのような粘着テープを有する、放熱性や組み立て作業性に優れた電子部品を提供する。【解決手段】本発明の粘着テープは、熱伝導抑制層と基材層とを有し、該熱伝導抑制層は、中空部分と表面層を含む中空微粒子を含み、該表面層が樹脂成分を主成分として含み、定常法によって測定される熱伝導率が０．０７Ｗ／ｍ・Ｋ以下である。【選択図】図１ |
| format | Patent |
| fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2015117292A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2015117292A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2015117292A3</originalsourceid><addsrcrecordid>eNrjZFBzdPFwDfYMc1Vw9vcN8A_2DPH091Nw9HNRgEuEOAa48jCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeK8AIwNDU0NDcyNLI0djohQBAP8rI-A</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ADHESIVE COMPOSITION AND ADHESIVE TAPE</title><source>esp@cenet</source><creator>MIKI KAORU ; HIRAO AKIRA</creator><creatorcontrib>MIKI KAORU ; HIRAO AKIRA</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide an adhesive tape capable of suppressing a temperature rise and generation of a hot spot on a surface of a housing, allowing very easy attachment to the housing, and having excellent adhesion to the housing, and also provide an electronic component having the adhesive tape that has excellent heat discharge properties and assembly workability.SOLUTION: An adhesive tape has a thermal conduction suppression layer and a substrate layer. The thermal conduction suppression layer includes hollow fine particles including a hollow part and a surface layer. The surface layer includes a resin component as a main component. A thermal conduction rate is 0.07 W/m K or lower, measured by a steady state method.
【課題】筐体表面の温度上昇およびホットスポットの発生を抑制することができ、さらに、筐体への取り付け作業がきわめて容易で、かつ、筐体への密着性に優れる粘着テープを提供する。また、そのような粘着テープを有する、放熱性や組み立て作業性に優れた電子部品を提供する。【解決手段】本発明の粘着テープは、熱伝導抑制層と基材層とを有し、該熱伝導抑制層は、中空部分と表面層を含む中空微粒子を含み、該表面層が樹脂成分を主成分として含み、定常法によって測定される熱伝導率が０．０７Ｗ／ｍ・Ｋ以下である。【選択図】図１</description><language>eng ; jpn</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; CHEMISTRY ; DYES ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150625&DB=EPODOC&CC=JP&NR=2015117292A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150625&DB=EPODOC&CC=JP&NR=2015117292A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MIKI KAORU</creatorcontrib><creatorcontrib>HIRAO AKIRA</creatorcontrib><title>ADHESIVE COMPOSITION AND ADHESIVE TAPE</title><description>PROBLEM TO BE SOLVED: To provide an adhesive tape capable of suppressing a temperature rise and generation of a hot spot on a surface of a housing, allowing very easy attachment to the housing, and having excellent adhesion to the housing, and also provide an electronic component having the adhesive tape that has excellent heat discharge properties and assembly workability.SOLUTION: An adhesive tape has a thermal conduction suppression layer and a substrate layer. The thermal conduction suppression layer includes hollow fine particles including a hollow part and a surface layer. The surface layer includes a resin component as a main component. A thermal conduction rate is 0.07 W/m K or lower, measured by a steady state method.
【課題】筐体表面の温度上昇およびホットスポットの発生を抑制することができ、さらに、筐体への取り付け作業がきわめて容易で、かつ、筐体への密着性に優れる粘着テープを提供する。また、そのような粘着テープを有する、放熱性や組み立て作業性に優れた電子部品を提供する。【解決手段】本発明の粘着テープは、熱伝導抑制層と基材層とを有し、該熱伝導抑制層は、中空部分と表面層を含む中空微粒子を含み、該表面層が樹脂成分を主成分として含み、定常法によって測定される熱伝導率が０．０７Ｗ／ｍ・Ｋ以下である。【選択図】図１</description><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</subject><subject>ADHESIVES</subject><subject>CHEMISTRY</subject><subject>DYES</subject><subject>METALLURGY</subject><subject>MISCELLANEOUS APPLICATIONS OF MATERIALS</subject><subject>MISCELLANEOUS COMPOSITIONS</subject><subject>NATURAL RESINS</subject><subject>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</subject><subject>PAINTS</subject><subject>POLISHES</subject><subject>USE OF MATERIALS AS ADHESIVES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZFBzdPFwDfYMc1Vw9vcN8A_2DPH091Nw9HNRgEuEOAa48jCwpiXmFKfyQmluBiU31xBnD93Ugvz41OKCxOTUvNSSeK8AIwNDU0NDcyNLI0djohQBAP8rI-A</recordid><startdate>20150625</startdate><enddate>20150625</enddate><creator>MIKI KAORU</creator><creator>HIRAO AKIRA</creator><scope>EVB</scope></search><sort><creationdate>20150625</creationdate><title>ADHESIVE COMPOSITION AND ADHESIVE TAPE</title><author>MIKI KAORU ; HIRAO AKIRA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2015117292A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2015</creationdate><topic>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE</topic><topic>ADHESIVES</topic><topic>CHEMISTRY</topic><topic>DYES</topic><topic>METALLURGY</topic><topic>MISCELLANEOUS APPLICATIONS OF MATERIALS</topic><topic>MISCELLANEOUS COMPOSITIONS</topic><topic>NATURAL RESINS</topic><topic>NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL</topic><topic>PAINTS</topic><topic>POLISHES</topic><topic>USE OF MATERIALS AS ADHESIVES</topic><toplevel>online_resources</toplevel><creatorcontrib>MIKI KAORU</creatorcontrib><creatorcontrib>HIRAO AKIRA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MIKI KAORU</au><au>HIRAO AKIRA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ADHESIVE COMPOSITION AND ADHESIVE TAPE</title><date>2015-06-25</date><risdate>2015</risdate><abstract>PROBLEM TO BE SOLVED: To provide an adhesive tape capable of suppressing a temperature rise and generation of a hot spot on a surface of a housing, allowing very easy attachment to the housing, and having excellent adhesion to the housing, and also provide an electronic component having the adhesive tape that has excellent heat discharge properties and assembly workability.SOLUTION: An adhesive tape has a thermal conduction suppression layer and a substrate layer. The thermal conduction suppression layer includes hollow fine particles including a hollow part and a surface layer. The surface layer includes a resin component as a main component. A thermal conduction rate is 0.07 W/m K or lower, measured by a steady state method.
【課題】筐体表面の温度上昇およびホットスポットの発生を抑制することができ、さらに、筐体への取り付け作業がきわめて容易で、かつ、筐体への密着性に優れる粘着テープを提供する。また、そのような粘着テープを有する、放熱性や組み立て作業性に優れた電子部品を提供する。【解決手段】本発明の粘着テープは、熱伝導抑制層と基材層とを有し、該熱伝導抑制層は、中空部分と表面層を含む中空微粒子を含み、該表面層が樹脂成分を主成分として含み、定常法によって測定される熱伝導率が０．０７Ｗ／ｍ・Ｋ以下である。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMISTRY DYES METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES USE OF MATERIALS AS ADHESIVES |
| title | ADHESIVE COMPOSITION AND ADHESIVE TAPE |
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