ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING SYSTEM
PROBLEM TO BE SOLVED: To provide an electronic component mounting method and an electronic component mounting system capable of precisely mounting electronic components at high density.SOLUTION: The electronic component mounting system includes a screen printing unit and a solder application unit. T...
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| creator | NAKATSUJI HACHIRO OKAMOTO KENJI |
| description | PROBLEM TO BE SOLVED: To provide an electronic component mounting method and an electronic component mounting system capable of precisely mounting electronic components at high density.SOLUTION: The electronic component mounting system includes a screen printing unit and a solder application unit. The screen printing unit has a mask plate 22 which has a first part and a second part each having a thickness different from each other. The mask plate 22 is formed with pattern holes 22a, 22b corresponding lands 5A, 5Ba other than lands 5Bb in the plural lands 5 provided on the substrate 4, which are positioned in a step portion as the boundary between the first part and the second part and in an area of the substrate 4 overlapped with the vicinity thereof. The screen printing unit performs screen-printing with solder PA on the plural lands 5A, 5Ba using the mask plate 22. The solder application unit separately applies solder PB to the lands 5Bb using a dispenser 37. An electronic component mounting unit mounts electronic components 6 on the substrate 4 supplied with the solder.
【課題】電子部品の高密度実装を高品質で行うことができる電子部品実装方法及び電子部品実装システムを提供する。【解決手段】電子部品実装システムは、スクリーン印刷装置とはんだ塗布装置を備える。スクリーン印刷装置に備えられたマスクプレート２２は、厚みが異なる第１部分と第２部分を有している。マスクプレート２２には、基板４に備えられた複数のランド５のうち、第１部分と第２部分の境界となる段差部及びその近傍に重なる基板４の領域に位置するランド５Ｂｂ以外のランド５Ａ，５Ｂａに対応してパターン孔２２ａ，２２ｂが形成されている。スクリーン印刷装置は、マスクプレート２２を使用してランド５Ａ，５ＢａにはんだＰＡをスクリーン印刷する。はんだ塗布装置は、ランド５Ｂｂにディスペンサ３７を用いてはんだＰＢを塗布する。電子部品搭載装置は、はんだ供給後の基板４に電子部品６を搭載する。【選択図】図８ |
| format | Patent |
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【課題】電子部品の高密度実装を高品質で行うことができる電子部品実装方法及び電子部品実装システムを提供する。【解決手段】電子部品実装システムは、スクリーン印刷装置とはんだ塗布装置を備える。スクリーン印刷装置に備えられたマスクプレート２２は、厚みが異なる第１部分と第２部分を有している。マスクプレート２２には、基板４に備えられた複数のランド５のうち、第１部分と第２部分の境界となる段差部及びその近傍に重なる基板４の領域に位置するランド５Ｂｂ以外のランド５Ａ，５Ｂａに対応してパターン孔２２ａ，２２ｂが形成されている。スクリーン印刷装置は、マスクプレート２２を使用してランド５Ａ，５ＢａにはんだＰＡをスクリーン印刷する。はんだ塗布装置は、ランド５Ｂｂにディスペンサ３７を用いてはんだＰＢを塗布する。電子部品搭載装置は、はんだ供給後の基板４に電子部品６を搭載する。【選択図】図８</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; COLOUR PRINTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; LINING MACHINES ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; PRINTING ; PRINTING MACHINES OR PRESSES ; PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES ; STAMPS ; TRANSPORTING ; TYPEWRITERS</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150611&DB=EPODOC&CC=JP&NR=2015109398A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150611&DB=EPODOC&CC=JP&NR=2015109398A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>NAKATSUJI HACHIRO</creatorcontrib><creatorcontrib>OKAMOTO KENJI</creatorcontrib><title>ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING SYSTEM</title><description>PROBLEM TO BE SOLVED: To provide an electronic component mounting method and an electronic component mounting system capable of precisely mounting electronic components at high density.SOLUTION: The electronic component mounting system includes a screen printing unit and a solder application unit. The screen printing unit has a mask plate 22 which has a first part and a second part each having a thickness different from each other. The mask plate 22 is formed with pattern holes 22a, 22b corresponding lands 5A, 5Ba other than lands 5Bb in the plural lands 5 provided on the substrate 4, which are positioned in a step portion as the boundary between the first part and the second part and in an area of the substrate 4 overlapped with the vicinity thereof. The screen printing unit performs screen-printing with solder PA on the plural lands 5A, 5Ba using the mask plate 22. The solder application unit separately applies solder PB to the lands 5Bb using a dispenser 37. An electronic component mounting unit mounts electronic components 6 on the substrate 4 supplied with the solder.
【課題】電子部品の高密度実装を高品質で行うことができる電子部品実装方法及び電子部品実装システムを提供する。【解決手段】電子部品実装システムは、スクリーン印刷装置とはんだ塗布装置を備える。スクリーン印刷装置に備えられたマスクプレート２２は、厚みが異なる第１部分と第２部分を有している。マスクプレート２２には、基板４に備えられた複数のランド５のうち、第１部分と第２部分の境界となる段差部及びその近傍に重なる基板４の領域に位置するランド５Ｂｂ以外のランド５Ａ，５Ｂａに対応してパターン孔２２ａ，２２ｂが形成されている。スクリーン印刷装置は、マスクプレート２２を使用してランド５Ａ，５ＢａにはんだＰＡをスクリーン印刷する。はんだ塗布装置は、ランド５Ｂｂにディスペンサ３７を用いてはんだＰＢを塗布する。電子部品搭載装置は、はんだ供給後の基板４に電子部品６を搭載する。【選択図】図８</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>COLOUR PRINTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>LINING MACHINES</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>PRINTING</subject><subject>PRINTING MACHINES OR PRESSES</subject><subject>PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES</subject><subject>STAMPS</subject><subject>TRANSPORTING</subject><subject>TYPEWRITERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZPB19XF1Dgny9_N0VnD29w3w93P1C1Hw9Q_1C_H0c1fwdQ3x8HdRcPRzUcCvMDgyOMTVl4eBNS0xpziVF0pzMyi5uYY4e-imFuTHpxYXJCan5qWWxHsFGBkYmhoaWBpbWjgaE6UIAIiFL0U</recordid><startdate>20150611</startdate><enddate>20150611</enddate><creator>NAKATSUJI HACHIRO</creator><creator>OKAMOTO KENJI</creator><scope>EVB</scope></search><sort><creationdate>20150611</creationdate><title>ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING SYSTEM</title><author>NAKATSUJI HACHIRO ; OKAMOTO KENJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2015109398A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2015</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>COLOUR PRINTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>LINING MACHINES</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>PRINTING</topic><topic>PRINTING MACHINES OR PRESSES</topic><topic>PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES</topic><topic>STAMPS</topic><topic>TRANSPORTING</topic><topic>TYPEWRITERS</topic><toplevel>online_resources</toplevel><creatorcontrib>NAKATSUJI HACHIRO</creatorcontrib><creatorcontrib>OKAMOTO KENJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>NAKATSUJI HACHIRO</au><au>OKAMOTO KENJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING SYSTEM</title><date>2015-06-11</date><risdate>2015</risdate><abstract>PROBLEM TO BE SOLVED: To provide an electronic component mounting method and an electronic component mounting system capable of precisely mounting electronic components at high density.SOLUTION: The electronic component mounting system includes a screen printing unit and a solder application unit. The screen printing unit has a mask plate 22 which has a first part and a second part each having a thickness different from each other. The mask plate 22 is formed with pattern holes 22a, 22b corresponding lands 5A, 5Ba other than lands 5Bb in the plural lands 5 provided on the substrate 4, which are positioned in a step portion as the boundary between the first part and the second part and in an area of the substrate 4 overlapped with the vicinity thereof. The screen printing unit performs screen-printing with solder PA on the plural lands 5A, 5Ba using the mask plate 22. The solder application unit separately applies solder PB to the lands 5Bb using a dispenser 37. An electronic component mounting unit mounts electronic components 6 on the substrate 4 supplied with the solder.
【課題】電子部品の高密度実装を高品質で行うことができる電子部品実装方法及び電子部品実装システムを提供する。【解決手段】電子部品実装システムは、スクリーン印刷装置とはんだ塗布装置を備える。スクリーン印刷装置に備えられたマスクプレート２２は、厚みが異なる第１部分と第２部分を有している。マスクプレート２２には、基板４に備えられた複数のランド５のうち、第１部分と第２部分の境界となる段差部及びその近傍に重なる基板４の領域に位置するランド５Ｂｂ以外のランド５Ａ，５Ｂａに対応してパターン孔２２ａ，２２ｂが形成されている。スクリーン印刷装置は、マスクプレート２２を使用してランド５Ａ，５ＢａにはんだＰＡをスクリーン印刷する。はんだ塗布装置は、ランド５Ｂｂにディスペンサ３７を用いてはんだＰＢを塗布する。電子部品搭載装置は、はんだ供給後の基板４に電子部品６を搭載する。【選択図】図８</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COLOUR PRINTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY LINING MACHINES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PERFORMING OPERATIONS PRINTED CIRCUITS PRINTING PRINTING MACHINES OR PRESSES PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES STAMPS TRANSPORTING TYPEWRITERS |
| title | ELECTRONIC COMPONENT MOUNTING METHOD AND ELECTRONIC COMPONENT MOUNTING SYSTEM |
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