PROBER

PROBLEM TO BE SOLVED: To provide a prober capable of enhancing measurement accuracy and reliability of a wafer level inspection in high-frequency measurement and dynamic measurement without being affected by temperature change of a wafer chuck.SOLUTION: A prober comprises: a wafer chuck having a con...

Ausführliche Beschreibung

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Bibliographische Detailangaben
Hauptverfasser: AOKI KAZUHISA, MORI TOSHIRO, YAMAGUCHI AKIRA, MURAKAMI KONOSUKE, SHIGESAWA YUJI
Format: Patent
Sprache:eng ; jpn
Schlagworte:
Online-Zugang:Volltext bestellen
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