PROBER
PROBLEM TO BE SOLVED: To provide a prober capable of enhancing measurement accuracy and reliability of a wafer level inspection in high-frequency measurement and dynamic measurement without being affected by temperature change of a wafer chuck.SOLUTION: A prober comprises: a wafer chuck having a con...
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| creator | AOKI KAZUHISA MORI TOSHIRO YAMAGUCHI AKIRA MURAKAMI KONOSUKE SHIGESAWA YUJI |
| description | PROBLEM TO BE SOLVED: To provide a prober capable of enhancing measurement accuracy and reliability of a wafer level inspection in high-frequency measurement and dynamic measurement without being affected by temperature change of a wafer chuck.SOLUTION: A prober comprises: a wafer chuck having a conductive supporting surface; a moving and rotating mechanism for moving and rotating the wafer chuck; a head stage holding a probe holding part; a stage member formed in parallel to the supporting surface, having a conductive stage surface electrically connected with the supporting surface, and capable of integrally moving with the wafer chuck; and a contactor fixed at a position opposed to the stage member, and having a front end electrically contactable with the stage surface. The stage member is separated from the wafer chuck. The stage surface and the supporting surface are electrically connected with each other via a wiring member. A rear face electrode of a chip is electrically connected with a tester via the wafer chuck, the wiring, the stage member, and the contactor.
【課題】ウエハチャックの温度変化による影響を受けることなく、高周波測定や動的測定でのウエハレベル検査の測定精度や信頼性を高めることができるプローバを提供する。【解決手段】導電性の支持面を有するウエハチャックと、ウエハチャックを移動及び回転する移動回転機構と、プローブ保持部を保持するヘッドステージと、支持面に対して平行に形成されると共に支持面に電気的に接続された導電性のステージ面を有し、ウエハチャックと一体的に移動可能なステージ部材と、ステージ部材に対面する位置に固定され、ステージ面に先端が電気的に接触可能な接触子とを備え、ステージ部材は、ウエハチャックとは別体で分離され、ステージ面と支持面は配線部材を介して電気的に接続され、チップの裏面電極はウエハチャック、配線、ステージ部材、及び接触子を介してテスタに電気的に接続される。【選択図】図１ |
| format | Patent |
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【課題】ウエハチャックの温度変化による影響を受けることなく、高周波測定や動的測定でのウエハレベル検査の測定精度や信頼性を高めることができるプローバを提供する。【解決手段】導電性の支持面を有するウエハチャックと、ウエハチャックを移動及び回転する移動回転機構と、プローブ保持部を保持するヘッドステージと、支持面に対して平行に形成されると共に支持面に電気的に接続された導電性のステージ面を有し、ウエハチャックと一体的に移動可能なステージ部材と、ステージ部材に対面する位置に固定され、ステージ面に先端が電気的に接触可能な接触子とを備え、ステージ部材は、ウエハチャックとは別体で分離され、ステージ面と支持面は配線部材を介して電気的に接続され、チップの裏面電極はウエハチャック、配線、ステージ部材、及び接触子を介してテスタに電気的に接続される。【選択図】図１</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MEASURING ; MEASURING ELECTRIC VARIABLES ; MEASURING MAGNETIC VARIABLES ; PHYSICS ; SEMICONDUCTOR DEVICES ; TESTING</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150604&DB=EPODOC&CC=JP&NR=2015103552A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76294</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150604&DB=EPODOC&CC=JP&NR=2015103552A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AOKI KAZUHISA</creatorcontrib><creatorcontrib>MORI TOSHIRO</creatorcontrib><creatorcontrib>YAMAGUCHI AKIRA</creatorcontrib><creatorcontrib>MURAKAMI KONOSUKE</creatorcontrib><creatorcontrib>SHIGESAWA YUJI</creatorcontrib><title>PROBER</title><description>PROBLEM TO BE SOLVED: To provide a prober capable of enhancing measurement accuracy and reliability of a wafer level inspection in high-frequency measurement and dynamic measurement without being affected by temperature change of a wafer chuck.SOLUTION: A prober comprises: a wafer chuck having a conductive supporting surface; a moving and rotating mechanism for moving and rotating the wafer chuck; a head stage holding a probe holding part; a stage member formed in parallel to the supporting surface, having a conductive stage surface electrically connected with the supporting surface, and capable of integrally moving with the wafer chuck; and a contactor fixed at a position opposed to the stage member, and having a front end electrically contactable with the stage surface. The stage member is separated from the wafer chuck. The stage surface and the supporting surface are electrically connected with each other via a wiring member. A rear face electrode of a chip is electrically connected with a tester via the wafer chuck, the wiring, the stage member, and the contactor.
【課題】ウエハチャックの温度変化による影響を受けることなく、高周波測定や動的測定でのウエハレベル検査の測定精度や信頼性を高めることができるプローバを提供する。【解決手段】導電性の支持面を有するウエハチャックと、ウエハチャックを移動及び回転する移動回転機構と、プローブ保持部を保持するヘッドステージと、支持面に対して平行に形成されると共に支持面に電気的に接続された導電性のステージ面を有し、ウエハチャックと一体的に移動可能なステージ部材と、ステージ部材に対面する位置に固定され、ステージ面に先端が電気的に接触可能な接触子とを備え、ステージ部材は、ウエハチャックとは別体で分離され、ステージ面と支持面は配線部材を介して電気的に接続され、チップの裏面電極はウエハチャック、配線、ステージ部材、及び接触子を介してテスタに電気的に接続される。【選択図】図１</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MEASURING</subject><subject>MEASURING ELECTRIC VARIABLES</subject><subject>MEASURING MAGNETIC VARIABLES</subject><subject>PHYSICS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>TESTING</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZGALCPJ3cg3iYWBNS8wpTuWF0twMSm6uIc4euqkF-fGpxQWJyal5qSXxXgFGBoamhgbGpqZGjsZEKQIAIBEbGw</recordid><startdate>20150604</startdate><enddate>20150604</enddate><creator>AOKI KAZUHISA</creator><creator>MORI TOSHIRO</creator><creator>YAMAGUCHI AKIRA</creator><creator>MURAKAMI KONOSUKE</creator><creator>SHIGESAWA YUJI</creator><scope>EVB</scope></search><sort><creationdate>20150604</creationdate><title>PROBER</title><author>AOKI KAZUHISA ; MORI TOSHIRO ; YAMAGUCHI AKIRA ; MURAKAMI KONOSUKE ; SHIGESAWA YUJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2015103552A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MEASURING</topic><topic>MEASURING ELECTRIC VARIABLES</topic><topic>MEASURING MAGNETIC VARIABLES</topic><topic>PHYSICS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>TESTING</topic><toplevel>online_resources</toplevel><creatorcontrib>AOKI KAZUHISA</creatorcontrib><creatorcontrib>MORI TOSHIRO</creatorcontrib><creatorcontrib>YAMAGUCHI AKIRA</creatorcontrib><creatorcontrib>MURAKAMI KONOSUKE</creatorcontrib><creatorcontrib>SHIGESAWA YUJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AOKI KAZUHISA</au><au>MORI TOSHIRO</au><au>YAMAGUCHI AKIRA</au><au>MURAKAMI KONOSUKE</au><au>SHIGESAWA YUJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PROBER</title><date>2015-06-04</date><risdate>2015</risdate><abstract>PROBLEM TO BE SOLVED: To provide a prober capable of enhancing measurement accuracy and reliability of a wafer level inspection in high-frequency measurement and dynamic measurement without being affected by temperature change of a wafer chuck.SOLUTION: A prober comprises: a wafer chuck having a conductive supporting surface; a moving and rotating mechanism for moving and rotating the wafer chuck; a head stage holding a probe holding part; a stage member formed in parallel to the supporting surface, having a conductive stage surface electrically connected with the supporting surface, and capable of integrally moving with the wafer chuck; and a contactor fixed at a position opposed to the stage member, and having a front end electrically contactable with the stage surface. The stage member is separated from the wafer chuck. The stage surface and the supporting surface are electrically connected with each other via a wiring member. A rear face electrode of a chip is electrically connected with a tester via the wafer chuck, the wiring, the stage member, and the contactor.
【課題】ウエハチャックの温度変化による影響を受けることなく、高周波測定や動的測定でのウエハレベル検査の測定精度や信頼性を高めることができるプローバを提供する。【解決手段】導電性の支持面を有するウエハチャックと、ウエハチャックを移動及び回転する移動回転機構と、プローブ保持部を保持するヘッドステージと、支持面に対して平行に形成されると共に支持面に電気的に接続された導電性のステージ面を有し、ウエハチャックと一体的に移動可能なステージ部材と、ステージ部材に対面する位置に固定され、ステージ面に先端が電気的に接触可能な接触子とを備え、ステージ部材は、ウエハチャックとは別体で分離され、ステージ面と支持面は配線部材を介して電気的に接続され、チップの裏面電極はウエハチャック、配線、ステージ部材、及び接触子を介してテスタに電気的に接続される。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MEASURING MEASURING ELECTRIC VARIABLES MEASURING MAGNETIC VARIABLES PHYSICS SEMICONDUCTOR DEVICES TESTING |
| title | PROBER |
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