PACKAGE
PROBLEM TO BE SOLVED: To provide a package in which a crystal oscillator can be surface-mounted, an electronic component can also be mounted within a cavity, a package body can be made thin (reduced in height) and overall downsizing including the thinning can be surely performed.SOLUTION: A package...
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| creator | AKITA KAZUE |
| description | PROBLEM TO BE SOLVED: To provide a package in which a crystal oscillator can be surface-mounted, an electronic component can also be mounted within a cavity, a package body can be made thin (reduced in height) and overall downsizing including the thinning can be surely performed.SOLUTION: A package 1a comprises: a package body 2 which is formed of ceramics (insulation materials) c1 and c2 and has a front face 3 and a rear face 4 having a rectangular shape in a plan view; a metal layer 12 which is formed along a peripheral part of the front face 3 of the package body 2 and has a frame shape in a plan view; a metal frame 15 which is joined on the metal layer 12 via a brazing material 13 and has a frame shape in a plan view; a pair of electrode pads 14 formed on the front face 3 of the package body 2 surrounded by the metal layer 12 for packaging the crystal vibrator; and an opening of a cavity 7 which is opened at a position excluding the pair of electrode pads 14 on the front face of the package body 2 surrounded by the metal layer 12. The metal layer 12, the pair of electrode pads 14 and the opening of the cavity 7 are positioned on the front face 3 that is the same plane.
【課題】水晶振動子を表面実装でき且つ電子部品をもキャビティ内に実装可能であって、パッケージ本体の薄肉化（低背化）、および該薄肉化を含む全体の小型化が確実に行えるパッケージを提供する。【解決手段】セラミック（絶縁材）ｃ１，ｃ２からなり、平面視が矩形状の表面３および裏面４を有するパッケージ本体２と、該パッケージ本体２の表面３の周辺部に沿って形成された平面視が枠状の金属層１２と、該金属層１２の上にロウ材１３を介して接合された平面視が枠状の金属枠１５と、上記金属層１２に囲まれたパッケージ本体２の表面３に形成された水晶振動子を搭載するための一対の電極パッド１４と、上記金属層１２に囲まれたパッケージ本体２の表面３のうち、上記一対の電極パッド１４を除いた位置に開口するキャビティ７の開口部と、を備え、上記金属層１２、一対の電極パッド１４、およびキャビティ７の開口部が同一平面である上記表面３に位置している、パッケージ１ａ。【選択図】 図２ |
| format | Patent |
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【課題】水晶振動子を表面実装でき且つ電子部品をもキャビティ内に実装可能であって、パッケージ本体の薄肉化（低背化）、および該薄肉化を含む全体の小型化が確実に行えるパッケージを提供する。【解決手段】セラミック（絶縁材）ｃ１，ｃ２からなり、平面視が矩形状の表面３および裏面４を有するパッケージ本体２と、該パッケージ本体２の表面３の周辺部に沿って形成された平面視が枠状の金属層１２と、該金属層１２の上にロウ材１３を介して接合された平面視が枠状の金属枠１５と、上記金属層１２に囲まれたパッケージ本体２の表面３に形成された水晶振動子を搭載するための一対の電極パッド１４と、上記金属層１２に囲まれたパッケージ本体２の表面３のうち、上記一対の電極パッド１４を除いた位置に開口するキャビティ７の開口部と、を備え、上記金属層１２、一対の電極パッド１４、およびキャビティ７の開口部が同一平面である上記表面３に位置している、パッケージ１ａ。【選択図】 図２</description><language>eng ; jpn</language><subject>BASIC ELECTRIC ELEMENTS ; BASIC ELECTRONIC CIRCUITRY ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; GENERATION OF NOISE BY SUCH CIRCUITS ; GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING,BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN ANON-SWITCHING MANNER ; IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS ; RESONATORS ; SEMICONDUCTOR DEVICES</subject><creationdate>2015</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150226&DB=EPODOC&CC=JP&NR=2015039133A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76419</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20150226&DB=EPODOC&CC=JP&NR=2015039133A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>AKITA KAZUE</creatorcontrib><title>PACKAGE</title><description>PROBLEM TO BE SOLVED: To provide a package in which a crystal oscillator can be surface-mounted, an electronic component can also be mounted within a cavity, a package body can be made thin (reduced in height) and overall downsizing including the thinning can be surely performed.SOLUTION: A package 1a comprises: a package body 2 which is formed of ceramics (insulation materials) c1 and c2 and has a front face 3 and a rear face 4 having a rectangular shape in a plan view; a metal layer 12 which is formed along a peripheral part of the front face 3 of the package body 2 and has a frame shape in a plan view; a metal frame 15 which is joined on the metal layer 12 via a brazing material 13 and has a frame shape in a plan view; a pair of electrode pads 14 formed on the front face 3 of the package body 2 surrounded by the metal layer 12 for packaging the crystal vibrator; and an opening of a cavity 7 which is opened at a position excluding the pair of electrode pads 14 on the front face of the package body 2 surrounded by the metal layer 12. The metal layer 12, the pair of electrode pads 14 and the opening of the cavity 7 are positioned on the front face 3 that is the same plane.
【課題】水晶振動子を表面実装でき且つ電子部品をもキャビティ内に実装可能であって、パッケージ本体の薄肉化（低背化）、および該薄肉化を含む全体の小型化が確実に行えるパッケージを提供する。【解決手段】セラミック（絶縁材）ｃ１，ｃ２からなり、平面視が矩形状の表面３および裏面４を有するパッケージ本体２と、該パッケージ本体２の表面３の周辺部に沿って形成された平面視が枠状の金属層１２と、該金属層１２の上にロウ材１３を介して接合された平面視が枠状の金属枠１５と、上記金属層１２に囲まれたパッケージ本体２の表面３に形成された水晶振動子を搭載するための一対の電極パッド１４と、上記金属層１２に囲まれたパッケージ本体２の表面３のうち、上記一対の電極パッド１４を除いた位置に開口するキャビティ７の開口部と、を備え、上記金属層１２、一対の電極パッド１４、およびキャビティ７の開口部が同一平面である上記表面３に位置している、パッケージ１ａ。【選択図】 図２</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BASIC ELECTRONIC CIRCUITRY</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>GENERATION OF NOISE BY SUCH CIRCUITS</subject><subject>GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING,BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN ANON-SWITCHING MANNER</subject><subject>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</subject><subject>RESONATORS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2015</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZGAPcHT2dnR35WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaGpgbGlobGxo7GRCkCAC6FG0Q</recordid><startdate>20150226</startdate><enddate>20150226</enddate><creator>AKITA KAZUE</creator><scope>EVB</scope></search><sort><creationdate>20150226</creationdate><title>PACKAGE</title><author>AKITA KAZUE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2015039133A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2015</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BASIC ELECTRONIC CIRCUITRY</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>GENERATION OF NOISE BY SUCH CIRCUITS</topic><topic>GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING,BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN ANON-SWITCHING MANNER</topic><topic>IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS</topic><topic>RESONATORS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>AKITA KAZUE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>AKITA KAZUE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>PACKAGE</title><date>2015-02-26</date><risdate>2015</risdate><abstract>PROBLEM TO BE SOLVED: To provide a package in which a crystal oscillator can be surface-mounted, an electronic component can also be mounted within a cavity, a package body can be made thin (reduced in height) and overall downsizing including the thinning can be surely performed.SOLUTION: A package 1a comprises: a package body 2 which is formed of ceramics (insulation materials) c1 and c2 and has a front face 3 and a rear face 4 having a rectangular shape in a plan view; a metal layer 12 which is formed along a peripheral part of the front face 3 of the package body 2 and has a frame shape in a plan view; a metal frame 15 which is joined on the metal layer 12 via a brazing material 13 and has a frame shape in a plan view; a pair of electrode pads 14 formed on the front face 3 of the package body 2 surrounded by the metal layer 12 for packaging the crystal vibrator; and an opening of a cavity 7 which is opened at a position excluding the pair of electrode pads 14 on the front face of the package body 2 surrounded by the metal layer 12. The metal layer 12, the pair of electrode pads 14 and the opening of the cavity 7 are positioned on the front face 3 that is the same plane.
【課題】水晶振動子を表面実装でき且つ電子部品をもキャビティ内に実装可能であって、パッケージ本体の薄肉化（低背化）、および該薄肉化を含む全体の小型化が確実に行えるパッケージを提供する。【解決手段】セラミック（絶縁材）ｃ１，ｃ２からなり、平面視が矩形状の表面３および裏面４を有するパッケージ本体２と、該パッケージ本体２の表面３の周辺部に沿って形成された平面視が枠状の金属層１２と、該金属層１２の上にロウ材１３を介して接合された平面視が枠状の金属枠１５と、上記金属層１２に囲まれたパッケージ本体２の表面３に形成された水晶振動子を搭載するための一対の電極パッド１４と、上記金属層１２に囲まれたパッケージ本体２の表面３のうち、上記一対の電極パッド１４を除いた位置に開口するキャビティ７の開口部と、を備え、上記金属層１２、一対の電極パッド１４、およびキャビティ７の開口部が同一平面である上記表面３に位置している、パッケージ１ａ。【選択図】 図２</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS BASIC ELECTRONIC CIRCUITRY ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY GENERATION OF NOISE BY SUCH CIRCUITS GENERATION OF OSCILLATIONS, DIRECTLY OR BY FREQUENCY-CHANGING,BY CIRCUITS EMPLOYING ACTIVE ELEMENTS WHICH OPERATE IN ANON-SWITCHING MANNER IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS RESONATORS SEMICONDUCTOR DEVICES |
| title | PACKAGE |
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