FILM DEPOSITION METHOD

PROBLEM TO BE SOLVED: To form a film having homogeneous quality and/or thickness in a film deposition method using a collision solidification phenomenon of particles.SOLUTION: Particles are allowed to collide with the surface of a substrate in the state where warp and/or waviness of the substrate ar...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MATSUSHIMA KIYOSHI, WATANABE MORIMICHI, OKOUCHI SOTA
Format:	Patent
Sprache:	eng ; jpn
Schlagworte:	CHEMICAL SURFACE TREATMENT CHEMISTRY COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL COATING MATERIAL WITH METALLIC MATERIAL COATING METALLIC MATERIAL DIFFUSION TREATMENT OF METALLIC MATERIAL INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL METALLURGY SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
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