CERAMIC ELECTRONIC COMPONENT

PROBLEM TO BE SOLVED: To provide a ceramic electronic component that ensures low height when mounted on a mounting base plate and, at the same time, is able to restrict noise emitted from the mounting base plate on which electronic components have been mounted.SOLUTION: A ceramic electronic component 10 comprises: a ceramic electronic component body 11 having an approximately rectangular parallelepiped ceramic element assembly 12, and an external electrode 14 formed to cover an end face of the ceramic element assembly 12; and a metal terminal 20 connected to the external electrode 14 of the ceramic electronic component body 11. The metal terminal 20 includes: a terminal junction part 22 connected to the end face of the ceramic electronic component body 11; an extension part 24 connected to the terminal junction part 22 and opposite one side face of the ceramic element assembly 12 via a gap; and a mounting part 26 connected to the extension part 24 and opposite the mounting face of the ceramic element assembly 12 via the gap. The terminal junction part 22 and the extension part 24 are connected. Also, on the mounting part side of the ceramic electronic component body 11, a notch 28 is formed between the terminal junction part 22 and the extension part 24. 【課題】実装基板への実装時における低背化を確保しつつ、電子部品を実装した実装基板の鳴きを抑制することができるセラミック電子部品を提供する。【解決手段】セラミック電子部品１０は、略直方体状のセラミック素体１２と、セラミック素体１２の端面を覆うように形成された外部電極１４とを有するセラミック電子部品本体１１と、セラミック電子部品本体１１の外部電極１４に接続される金属端子２０とを含む。金属端子２０は、セラミック電子部品本体１１の端面に接続される端子接合部と２２、端子接合部２２に接続されセラミック素体１２の１つの側面と隙間を介して対向する延長部２４と、延長部２４に接続されセラミック素体１２の実装面と隙間を介して対向する実装部２６とを含む。端子接合部２２と延長部２４とが接続されるとともに、セラミック電子部品本体１１の実装部側において、端子接合部２２と延長部２４との間に切欠き２８が形成される。【選択図】図１