INSTRUMENT PANEL STRUCTURE
PROBLEM TO BE SOLVED: To obtain an instrument panel structure which can further effectively utilize waste heat discharged from a heat source member.SOLUTION: Heat in a housing 32 is moved to air in a communication member 36 by making the inside of the housing 32 and the inside of a defroster nozzle...
Gespeichert in:
1. Verfasser: | |
---|---|
Format: | Patent |
Sprache: | eng ; jpn |
Schlagworte: | |
Online-Zugang: | Volltext bestellen |
Tags: |
Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
|
Schreiben Sie den ersten Kommentar!