INSTRUMENT PANEL STRUCTURE

PROBLEM TO BE SOLVED: To obtain an instrument panel structure which can further effectively utilize waste heat discharged from a heat source member.SOLUTION: Heat in a housing 32 is moved to air in a communication member 36 by making the inside of the housing 32 and the inside of a defroster nozzle...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: SAKIMOTO SHUYA
Format: Patent
Sprache:eng ; jpn
Schlagworte:
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