METHOD OF REDUCING SURFACE OXIDE AND SOLDERING APPARATUS
PROBLEM TO BE SOLVED: To provide a method of reducing surface oxide and a soldering apparatus which is easy to handle, allows use of a wide range of members and allows reduction of voids in soldered parts.SOLUTION: Metal oxide formed on the surface of a solder is reduced by using a reductive gas obt...
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| creator | SUZUKI TAKAYUKI OGI MAKOTO OZAWA NAOTO MOTOJIMA YASUHIRO |
| description | PROBLEM TO BE SOLVED: To provide a method of reducing surface oxide and a soldering apparatus which is easy to handle, allows use of a wide range of members and allows reduction of voids in soldered parts.SOLUTION: Metal oxide formed on the surface of a solder is reduced by using a reductive gas obtained by thermal decomposition of a polyacetal resin. A soldering apparatus includes a heating furnace for decomposing a polyacetal resin thermally to gasify and a reaction furnace for reducing by using the reductive gas produced by thermal decomposition of the polyacetal resin. The gas produced in the heating furnace is introduced into the reaction furnace, a reflow treatment is executed in the reaction furnace.
【課題】取扱いが容易で、しかも使用できる部材の範囲が広く、半田付け部分のボイドを低減することが可能な表面酸化物の還元方法及び半田付け装置を提供する。【解決手段】半田表面に形成された金属酸化物を、ポリアセタール樹脂の熱分解により得られる還元性ガスを用いて還元する。半田付け装置は、ポリアセタール樹脂を熱分解してガス化させる加熱炉と、ポリアセタール樹脂の熱分解により生成される還元性ガスを用いて還元する反応炉とを備えており、加熱炉で生成したガスを反応炉に導入し、反応炉でリフロー処理する。【選択図】図１ |
| format | Patent |
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【課題】取扱いが容易で、しかも使用できる部材の範囲が広く、半田付け部分のボイドを低減することが可能な表面酸化物の還元方法及び半田付け装置を提供する。【解決手段】半田表面に形成された金属酸化物を、ポリアセタール樹脂の熱分解により得られる還元性ガスを用いて還元する。半田付け装置は、ポリアセタール樹脂を熱分解してガス化させる加熱炉と、ポリアセタール樹脂の熱分解により生成される還元性ガスを用いて還元する反応炉とを備えており、加熱炉で生成したガスを反応炉に導入し、反応炉でリフロー処理する。【選択図】図１</description><language>eng ; jpn</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141016&DB=EPODOC&CC=JP&NR=2014195809A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20141016&DB=EPODOC&CC=JP&NR=2014195809A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SUZUKI TAKAYUKI</creatorcontrib><creatorcontrib>OGI MAKOTO</creatorcontrib><creatorcontrib>OZAWA NAOTO</creatorcontrib><creatorcontrib>MOTOJIMA YASUHIRO</creatorcontrib><title>METHOD OF REDUCING SURFACE OXIDE AND SOLDERING APPARATUS</title><description>PROBLEM TO BE SOLVED: To provide a method of reducing surface oxide and a soldering apparatus which is easy to handle, allows use of a wide range of members and allows reduction of voids in soldered parts.SOLUTION: Metal oxide formed on the surface of a solder is reduced by using a reductive gas obtained by thermal decomposition of a polyacetal resin. A soldering apparatus includes a heating furnace for decomposing a polyacetal resin thermally to gasify and a reaction furnace for reducing by using the reductive gas produced by thermal decomposition of the polyacetal resin. The gas produced in the heating furnace is introduced into the reaction furnace, a reflow treatment is executed in the reaction furnace.
【課題】取扱いが容易で、しかも使用できる部材の範囲が広く、半田付け部分のボイドを低減することが可能な表面酸化物の還元方法及び半田付け装置を提供する。【解決手段】半田表面に形成された金属酸化物を、ポリアセタール樹脂の熱分解により得られる還元性ガスを用いて還元する。半田付け装置は、ポリアセタール樹脂を熱分解してガス化させる加熱炉と、ポリアセタール樹脂の熱分解により生成される還元性ガスを用いて還元する反応炉とを備えており、加熱炉で生成したガスを反応炉に導入し、反応炉でリフロー処理する。【選択図】図１</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZLDwdQ3x8HdR8HdTCHJ1CXX29HNXCA4NcnN0dlXwj_B0cVVw9HNRCPb3cXENAsk5BgQ4BjmGhAbzMLCmJeYUp_JCaW4GJTfXEGcP3dSC_PjU4oLE5NS81JJ4rwAjA0MTQ0tTCwNLR2OiFAEAoKco1Q</recordid><startdate>20141016</startdate><enddate>20141016</enddate><creator>SUZUKI TAKAYUKI</creator><creator>OGI MAKOTO</creator><creator>OZAWA NAOTO</creator><creator>MOTOJIMA YASUHIRO</creator><scope>EVB</scope></search><sort><creationdate>20141016</creationdate><title>METHOD OF REDUCING SURFACE OXIDE AND SOLDERING APPARATUS</title><author>SUZUKI TAKAYUKI ; OGI MAKOTO ; OZAWA NAOTO ; MOTOJIMA YASUHIRO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2014195809A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng ; jpn</language><creationdate>2014</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>SUZUKI TAKAYUKI</creatorcontrib><creatorcontrib>OGI MAKOTO</creatorcontrib><creatorcontrib>OZAWA NAOTO</creatorcontrib><creatorcontrib>MOTOJIMA YASUHIRO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SUZUKI TAKAYUKI</au><au>OGI MAKOTO</au><au>OZAWA NAOTO</au><au>MOTOJIMA YASUHIRO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF REDUCING SURFACE OXIDE AND SOLDERING APPARATUS</title><date>2014-10-16</date><risdate>2014</risdate><abstract>PROBLEM TO BE SOLVED: To provide a method of reducing surface oxide and a soldering apparatus which is easy to handle, allows use of a wide range of members and allows reduction of voids in soldered parts.SOLUTION: Metal oxide formed on the surface of a solder is reduced by using a reductive gas obtained by thermal decomposition of a polyacetal resin. A soldering apparatus includes a heating furnace for decomposing a polyacetal resin thermally to gasify and a reaction furnace for reducing by using the reductive gas produced by thermal decomposition of the polyacetal resin. The gas produced in the heating furnace is introduced into the reaction furnace, a reflow treatment is executed in the reaction furnace.
【課題】取扱いが容易で、しかも使用できる部材の範囲が広く、半田付け部分のボイドを低減することが可能な表面酸化物の還元方法及び半田付け装置を提供する。【解決手段】半田表面に形成された金属酸化物を、ポリアセタール樹脂の熱分解により得られる還元性ガスを用いて還元する。半田付け装置は、ポリアセタール樹脂を熱分解してガス化させる加熱炉と、ポリアセタール樹脂の熱分解により生成される還元性ガスを用いて還元する反応炉とを備えており、加熱炉で生成したガスを反応炉に導入し、反応炉でリフロー処理する。【選択図】図１</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | METHOD OF REDUCING SURFACE OXIDE AND SOLDERING APPARATUS |
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