METHOD FOR FORMING WIRING LINE, CONDUCTIVE PATTERN SUBSTRATE, TOUCH PANEL SENSOR AND PHOTOSENSITIVE CONDUCTIVE FILM

PROBLEM TO BE SOLVED: To provide a method for forming a conductive pattern, by which a wiring line as thin as about 15 μm or less can be formed through a small number of steps.SOLUTION: A method for forming a wiring pattern is provided, which includes steps in the following order: a step of laminati...

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Bibliographische Detailangaben

Hauptverfasser:	EBIHARA MASAHIKO, HATAKEYAMA SHUICHI, MURAKAMI TAIJI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS SPECIALLY ADAPTED THEREFOR CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY MATERIALS THEREFOR ORIGINALS THEREFOR PHOTOGRAPHY PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES PHYSICS
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