CHEMICAL MECHANICAL POLISHING PAD WITH BROAD-SPECTRUM ENDPOINT DETECTION WINDOW, AND POLISHING METHOD USING THE SAME
PROBLEM TO BE SOLVED: To solve a problem that a window block used in a window part of a polishing pad for detection of a substrate polishing endpoint deteriorates when exposed to light with shorter wavelengths.SOLUTION: A chemical mechanical polishing pad is provided, comprising: a polishing layer 2...
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| creator | MARY A LEUGERS JAMES DAVID B ANGUS REPPER |
| description | PROBLEM TO BE SOLVED: To solve a problem that a window block used in a window part of a polishing pad for detection of a substrate polishing endpoint deteriorates when exposed to light with shorter wavelengths.SOLUTION: A chemical mechanical polishing pad is provided, comprising: a polishing layer 20 having a polishing surface 25; and a broad-spectrum endpoint detection window block 30 having a thickness along an axis perpendicular to a plane of the polishing surface. The broad-spectrum endpoint detection window block comprises a cyclic olefin copolymer. The broad-spectrum endpoint detection window block exhibits a uniform chemical composition across its thickness. The broad-spectrum endpoint detection window block exhibits a spectrum loss of 40% or less. The polishing surface is adapted for polishing a substrate selected from a magnetic substrate, an optical substrate, and a semiconductor substrate. |
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The broad-spectrum endpoint detection window block comprises a cyclic olefin copolymer. The broad-spectrum endpoint detection window block exhibits a uniform chemical composition across its thickness. The broad-spectrum endpoint detection window block exhibits a spectrum loss of 40% or less. The polishing surface is adapted for polishing a substrate selected from a magnetic substrate, an optical substrate, and a semiconductor substrate.</description><language>eng</language><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G ; BASIC ELECTRIC ELEMENTS ; CHEMISTRY ; COMPOSITIONS BASED THEREON ; DRESSING OR CONDITIONING OF ABRADING SURFACES ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ; GENERAL PROCESSES OF COMPOUNDING ; GRINDING ; MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING ; METALLURGY ; ORGANIC MACROMOLECULAR COMPOUNDS ; PERFORMING OPERATIONS ; POLISHING ; SEMICONDUCTOR DEVICES ; THEIR PREPARATION OR CHEMICAL WORKING-UP ; TRANSPORTING ; WORKING-UP</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140922&DB=EPODOC&CC=JP&NR=2014172168A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140922&DB=EPODOC&CC=JP&NR=2014172168A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>MARY A LEUGERS</creatorcontrib><creatorcontrib>JAMES DAVID B</creatorcontrib><creatorcontrib>ANGUS REPPER</creatorcontrib><title>CHEMICAL MECHANICAL POLISHING PAD WITH BROAD-SPECTRUM ENDPOINT DETECTION WINDOW, AND POLISHING METHOD USING THE SAME</title><description>PROBLEM TO BE SOLVED: To solve a problem that a window block used in a window part of a polishing pad for detection of a substrate polishing endpoint deteriorates when exposed to light with shorter wavelengths.SOLUTION: A chemical mechanical polishing pad is provided, comprising: a polishing layer 20 having a polishing surface 25; and a broad-spectrum endpoint detection window block 30 having a thickness along an axis perpendicular to a plane of the polishing surface. The broad-spectrum endpoint detection window block comprises a cyclic olefin copolymer. The broad-spectrum endpoint detection window block exhibits a uniform chemical composition across its thickness. The broad-spectrum endpoint detection window block exhibits a spectrum loss of 40% or less. The polishing surface is adapted for polishing a substrate selected from a magnetic substrate, an optical substrate, and a semiconductor substrate.</description><subject>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</subject><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CHEMISTRY</subject><subject>COMPOSITIONS BASED THEREON</subject><subject>DRESSING OR CONDITIONING OF ABRADING SURFACES</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</subject><subject>GENERAL PROCESSES OF COMPOUNDING</subject><subject>GRINDING</subject><subject>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</subject><subject>METALLURGY</subject><subject>ORGANIC MACROMOLECULAR COMPOUNDS</subject><subject>PERFORMING OPERATIONS</subject><subject>POLISHING</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>THEIR PREPARATION OR CHEMICAL WORKING-UP</subject><subject>TRANSPORTING</subject><subject>WORKING-UP</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNjD0LwkAQRNNYiPofFmsDJorarnerd5L7ILchZQhyVqKB5P9jFAtLq5l5PGaaDEKR0QILMCQU2k_1rtBBaXsGjxJqzQqOpUOZBk-Cy8oAWemdtgySeETa2VGz0tUrQCt_DgyxchKq8B6sCAIamieTW3vv4-Kbs2R5IhYqjd2ziX3XXuMjDs3F5-tsm-3zbHfAzV_SCwcKOSI</recordid><startdate>20140922</startdate><enddate>20140922</enddate><creator>MARY A LEUGERS</creator><creator>JAMES DAVID B</creator><creator>ANGUS REPPER</creator><scope>EVB</scope></search><sort><creationdate>20140922</creationdate><title>CHEMICAL MECHANICAL POLISHING PAD WITH BROAD-SPECTRUM ENDPOINT DETECTION WINDOW, AND POLISHING METHOD USING THE SAME</title><author>MARY A LEUGERS ; JAMES DAVID B ; ANGUS REPPER</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2014172168A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G</topic><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CHEMISTRY</topic><topic>COMPOSITIONS BASED THEREON</topic><topic>DRESSING OR CONDITIONING OF ABRADING SURFACES</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS</topic><topic>GENERAL PROCESSES OF COMPOUNDING</topic><topic>GRINDING</topic><topic>MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING</topic><topic>METALLURGY</topic><topic>ORGANIC MACROMOLECULAR COMPOUNDS</topic><topic>PERFORMING OPERATIONS</topic><topic>POLISHING</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>THEIR PREPARATION OR CHEMICAL WORKING-UP</topic><topic>TRANSPORTING</topic><topic>WORKING-UP</topic><toplevel>online_resources</toplevel><creatorcontrib>MARY A LEUGERS</creatorcontrib><creatorcontrib>JAMES DAVID B</creatorcontrib><creatorcontrib>ANGUS REPPER</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>MARY A LEUGERS</au><au>JAMES DAVID B</au><au>ANGUS REPPER</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CHEMICAL MECHANICAL POLISHING PAD WITH BROAD-SPECTRUM ENDPOINT DETECTION WINDOW, AND POLISHING METHOD USING THE SAME</title><date>2014-09-22</date><risdate>2014</risdate><abstract>PROBLEM TO BE SOLVED: To solve a problem that a window block used in a window part of a polishing pad for detection of a substrate polishing endpoint deteriorates when exposed to light with shorter wavelengths.SOLUTION: A chemical mechanical polishing pad is provided, comprising: a polishing layer 20 having a polishing surface 25; and a broad-spectrum endpoint detection window block 30 having a thickness along an axis perpendicular to a plane of the polishing surface. The broad-spectrum endpoint detection window block comprises a cyclic olefin copolymer. The broad-spectrum endpoint detection window block exhibits a uniform chemical composition across its thickness. The broad-spectrum endpoint detection window block exhibits a spectrum loss of 40% or less. The polishing surface is adapted for polishing a substrate selected from a magnetic substrate, an optical substrate, and a semiconductor substrate.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON DRESSING OR CONDITIONING OF ABRADING SURFACES ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS GENERAL PROCESSES OF COMPOUNDING GRINDING MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS PERFORMING OPERATIONS POLISHING SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING WORKING-UP |
| title | CHEMICAL MECHANICAL POLISHING PAD WITH BROAD-SPECTRUM ENDPOINT DETECTION WINDOW, AND POLISHING METHOD USING THE SAME |
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