CHEMICAL MECHANICAL POLISHING PAD WITH BROAD-SPECTRUM ENDPOINT DETECTION WINDOW, AND POLISHING METHOD USING THE SAME

PROBLEM TO BE SOLVED: To solve a problem that a window block used in a window part of a polishing pad for detection of a substrate polishing endpoint deteriorates when exposed to light with shorter wavelengths.SOLUTION: A chemical mechanical polishing pad is provided, comprising: a polishing layer 20 having a polishing surface 25; and a broad-spectrum endpoint detection window block 30 having a thickness along an axis perpendicular to a plane of the polishing surface. The broad-spectrum endpoint detection window block comprises a cyclic olefin copolymer. The broad-spectrum endpoint detection window block exhibits a uniform chemical composition across its thickness. The broad-spectrum endpoint detection window block exhibits a spectrum loss of 40% or less. The polishing surface is adapted for polishing a substrate selected from a magnetic substrate, an optical substrate, and a semiconductor substrate.