PRINTED WIRING BOARD, COMPOSITE PRINTED WIRING BOARD, ELECTRONIC APPARATUS, AND METHOD FOR MANUFACTURING PRINTED WIRING BOARD

PROBLEM TO BE SOLVED: To provide a printed wiring board capable of improving packaging density and design freedom of a printed circuit.SOLUTION: A printed wiring board 10 according to the present invention is a printed wiring board in which a plurality of wiring layers 22 having a wiring pattern for...

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Bibliographische Detailangaben
1. Verfasser:	SUDO SHUJI
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a printed wiring board capable of improving packaging density and design freedom of a printed circuit.SOLUTION: A printed wiring board 10 according to the present invention is a printed wiring board in which a plurality of wiring layers 22 having a wiring pattern formed thereon are laminated. A side-face through hole 11 is formed on a side face of the printed wiring board 10, the side-face through hole being holed so as to be connected to an inner layer wiring pattern. The inner layer wiring pattern connected by the side-face through hole 11 may be formed on one layer or over a plurality of layers.