SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To achieve downsizing of a semiconductor device in which a cap wafer is bonded to a device wafer.SOLUTION: A semiconductor device manufacturing method comprises: forming an oxide film 64 on one surface 61 of a semiconductor substrate 63 before forming a cavity 66; and forming t...

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Bibliographische Detailangaben

1. Verfasser:	MURATA TOMOYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
Online-Zugang:	Volltext bestellen
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