SEMICONDUCTOR COOLING STRUCTURE
PROBLEM TO BE SOLVED: To allow for prevention of deformation mainly of the lower cooling section.SOLUTION: A semiconductor cooling structure includes a power module 22, a lower cooling section 23, an upper cooling section 24, a load receiving plate 25, and an elastic member 26. The lower cooling sec...
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| creator | SUGAWARA HIROMASA YOSHIHARA TOSHIKAZU HAMASAKI YUICHI KOBAYASHI HIDETAKA SAWAGUCHI MASA |
| description | PROBLEM TO BE SOLVED: To allow for prevention of deformation mainly of the lower cooling section.SOLUTION: A semiconductor cooling structure includes a power module 22, a lower cooling section 23, an upper cooling section 24, a load receiving plate 25, and an elastic member 26. The lower cooling section 23 is liquid cooling type including a lower cooling section body 28, and radiation fins 29. The radiation fins 29 extend downward from the inner upper surface of the lower cooling section body 28, and there is a small gap 28c between the lower end and the inner lower surface 28b of the lower cooling section body 28. On the lower side of the radiation fins 29, a deformation prevention part 41 capable of preventing deformation of the lower cooling section 23 by a push load from the upper cooling section 24 is provided. |
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| subjects | BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES |
| title | SEMICONDUCTOR COOLING STRUCTURE |
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