FILM-LIKE CIRCUIT CONNECTION MATERIAL AND CIRCUIT CONNECTION STRUCTURE
PROBLEM TO BE SOLVED: To provide a film-like circuit connection material having excellent insulation which can ensure visibility by a sensor while reducing connection resistance between circuit electrodes, and to provide a circuit connection structure using the same.SOLUTION: A film-like circuit con...
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| creator | KUDO SUNAO KOBAYASHI TAKANOBU MATSUDA KAZUYA TATEZAWA TAKASHI FUJINAWA MITSUGI KUME MASAHIDE |
| description | PROBLEM TO BE SOLVED: To provide a film-like circuit connection material having excellent insulation which can ensure visibility by a sensor while reducing connection resistance between circuit electrodes, and to provide a circuit connection structure using the same.SOLUTION: A film-like circuit connection material 1 has an adhesive layer 61 interposed between circuit electrodes facing each other, and interconnecting the circuit electrodes. The adhesive layer 61 contains an adhesive component 3 containing (a) a thermoplastic resin, (b) a curable material, (c) a hardener, and (d) a dye stuff, and conductive particles 5 which is a metal plating having a plastic nucleus and a metal layer covering the plastic nucleus, where the outermost layer of the metal layer contains at least one kind selected from Ni, an Ni alloy and an Ni oxide, and having an average grain size of 2.0-3.5 μm. |
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The adhesive layer 61 contains an adhesive component 3 containing (a) a thermoplastic resin, (b) a curable material, (c) a hardener, and (d) a dye stuff, and conductive particles 5 which is a metal plating having a plastic nucleus and a metal layer covering the plastic nucleus, where the outermost layer of the metal layer contains at least one kind selected from Ni, an Ni alloy and an Ni oxide, and having an average grain size of 2.0-3.5 μm.</description><language>eng</language><subject>ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ; ADHESIVES ; BASIC ELECTRIC ELEMENTS ; CABLES ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CONDUCTORS ; CURRENT COLLECTORS ; DYES ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; INSULATORS ; LINE CONNECTORS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METALLURGY ; MISCELLANEOUS APPLICATIONS OF MATERIALS ; MISCELLANEOUS COMPOSITIONS ; NATURAL RESINS ; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ; PAINTS ; POLISHES ; PRINTED CIRCUITS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; USE OF MATERIALS AS ADHESIVES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140821&DB=EPODOC&CC=JP&NR=2014149918A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25562,76317</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140821&DB=EPODOC&CC=JP&NR=2014149918A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KUDO SUNAO</creatorcontrib><creatorcontrib>KOBAYASHI TAKANOBU</creatorcontrib><creatorcontrib>MATSUDA KAZUYA</creatorcontrib><creatorcontrib>TATEZAWA TAKASHI</creatorcontrib><creatorcontrib>FUJINAWA MITSUGI</creatorcontrib><creatorcontrib>KUME MASAHIDE</creatorcontrib><title>FILM-LIKE CIRCUIT CONNECTION MATERIAL AND CIRCUIT CONNECTION STRUCTURE</title><description>PROBLEM TO BE SOLVED: To provide a film-like circuit connection material having excellent insulation which can ensure visibility by a sensor while reducing connection resistance between circuit electrodes, and to provide a circuit connection structure using the same.SOLUTION: A film-like circuit connection material 1 has an adhesive layer 61 interposed between circuit electrodes facing each other, and interconnecting the circuit electrodes. 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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES BASIC ELECTRIC ELEMENTS CABLES CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CONDUCTORS CURRENT COLLECTORS DYES ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY INSULATORS LINE CONNECTORS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL PAINTS POLISHES PRINTED CIRCUITS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES USE OF MATERIALS AS ADHESIVES |
| title | FILM-LIKE CIRCUIT CONNECTION MATERIAL AND CIRCUIT CONNECTION STRUCTURE |
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