ELECTRONIC COMPONENT MOUNTING PACKAGE AND ELECTRONIC DEVICE USING THE SAME

PROBLEM TO BE SOLVED: To provide a highly reliable electronic component mounting package and an electronic device using the same.SOLUTION: An electronic component mounting package comprises: a substrate 1 including an electronic component mounting portion 1a arranged on an upper face and a through-hole 1b provided from the upper face to a lower face; a sealant 2 provided in the through-hole 1b; and a terminal 3 having a heat expansion coefficient different from that of the substrate 1, which penetrates the sealant 2 so as to be fixed to the substrate 1, and has a top end protruding upward from the upper face of the substrate 1 and a bottom end protruding downward from the lower face of the substrate 1, and to which an electronic component 4 is electrically connected. The sealant 2 is provided in a central portion in a vertical direction of the through-hole 1b so that, on an upper edge and a lower edge of the through-hole 1b, a void 2a is formed between the terminal 3 and an inner face of the through-hole 1b.