SUBSTRATE THERMAL TREATMENT APPARATUS, SUBSTRATE THERMAL TREATMENT METHOD, AND RECORDING MEDIUM FOR SUBSTRATE THERMAL TREATMENT

PROBLEM TO BE SOLVED: To provide a device and a method which perform thermal treatment on a substrate in sufficiently uniform temperature distribution, and to provide a recording medium.SOLUTION: A heating/cooling unit U2 includes: a heat plate 10 which supports a wafer W horizontally placed and hea...

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Bibliographische Detailangaben
Hauptverfasser: TSURUTA TOYOHISA, KYODA HIDEJI
Format: Patent
Sprache:eng
Schlagworte:
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