SEMICONDUCTOR MODULE

PROBLEM TO BE SOLVED: To facilitate fitting of a resin case to an auxiliary terminal when assembling, and to prevent transmission of stress to the root of the auxiliary terminal or an insulation wiring board when attaching a connector for connection of an external terminal.SOLUTION: In a semiconduct...

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1. Verfasser:	HORIE SHUNTA
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
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creator	HORIE SHUNTA
description	PROBLEM TO BE SOLVED: To facilitate fitting of a resin case to an auxiliary terminal when assembling, and to prevent transmission of stress to the root of the auxiliary terminal or an insulation wiring board when attaching a connector for connection of an external terminal.SOLUTION: In a semiconductor module including a plurality of semiconductor elements 22 mounted on an insulation wiring board 21 bonded onto a metal base substrate 20, a resin case 26 for housing the semiconductor elements 22, and a metal main terminal 24 and an auxiliary terminal 25 being led out from the opening 28a in the surface flat part 24a of the resin case 26, an opening 28b for leading out the auxiliary terminal 25 to the upper surface of the resin case 26 is provided at a peripheral lower part 33, and a segment 34 for fixing the auxiliary terminal 25 is provided between a central flat high portion 32 and the auxiliary terminal 25.
format	Patent
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subjects	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY SEMICONDUCTOR DEVICES
title	SEMICONDUCTOR MODULE
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