SEMICONDUCTOR DEVICE MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a manufacturing method which avoids the occurrence of failure and which can manufacture a surface-mounted semiconductor device stably and with excellent mass productivity.SOLUTION: A semiconductor device manufacturing method sequentially performs: a process of prepar...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: INOUE YOSHIHIRO, HAMADA YOICHIRO
Format: Patent
Sprache:eng
Schlagworte:
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!