STRUCTURE AND METHOD OF PRODUCING THE SAME
PROBLEM TO BE SOLVED: To provide a method of producing a structure which is provided with a plating film containing an element having a trivalent or higher valence and being capable of taking a plurality of states of different valences and allows increasing the thickness of the plating film and smoo...
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| creator | OKI HIROAKI SUWATA OSAMU NUMATA KOMA NITTA KOJI INAZAWA SHINJI SUGISAWA MASANORI |
| description | PROBLEM TO BE SOLVED: To provide a method of producing a structure which is provided with a plating film containing an element having a trivalent or higher valence and being capable of taking a plurality of states of different valences and allows increasing the thickness of the plating film and smoothing the surfaces and a structure obtained by the method.SOLUTION: A method of producing a structure includes a step of preparing a molten salt, a step of preparing a conductive substrate and a step of forming a plating film. In the step of preparing a molten salt, a molten salt containing an element having a trivalent or higher valence and being capable of taking a plurality of states of different valences is prepared. In the step of forming a plating film, with the substrate immersed in the molten salt, a plating film containing the element is formed on the surface of the substrate by a plating method. In the plating step, a step (S21) of growing the plating film on the surface of the substrate by electrifying between the substrate and the molten salt and a step (S22) of adjusting growing conditions for the plating film after stopping the step of growing the plating film are repeated alternately. |
| format | Patent |
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In the step of preparing a molten salt, a molten salt containing an element having a trivalent or higher valence and being capable of taking a plurality of states of different valences is prepared. In the step of forming a plating film, with the substrate immersed in the molten salt, a plating film containing the element is formed on the surface of the substrate by a plating method. In the plating step, a step (S21) of growing the plating film on the surface of the substrate by electrifying between the substrate and the molten salt and a step (S22) of adjusting growing conditions for the plating film after stopping the step of growing the plating film are repeated alternately.</description><language>eng</language><subject>APPARATUS THEREFOR ; CHEMISTRY ; ELECTROFORMING ; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES ; METALLURGY ; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140626&DB=EPODOC&CC=JP&NR=2014114496A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25544,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140626&DB=EPODOC&CC=JP&NR=2014114496A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>OKI HIROAKI</creatorcontrib><creatorcontrib>SUWATA OSAMU</creatorcontrib><creatorcontrib>NUMATA KOMA</creatorcontrib><creatorcontrib>NITTA KOJI</creatorcontrib><creatorcontrib>INAZAWA SHINJI</creatorcontrib><creatorcontrib>SUGISAWA MASANORI</creatorcontrib><title>STRUCTURE AND METHOD OF PRODUCING THE SAME</title><description>PROBLEM TO BE SOLVED: To provide a method of producing a structure which is provided with a plating film containing an element having a trivalent or higher valence and being capable of taking a plurality of states of different valences and allows increasing the thickness of the plating film and smoothing the surfaces and a structure obtained by the method.SOLUTION: A method of producing a structure includes a step of preparing a molten salt, a step of preparing a conductive substrate and a step of forming a plating film. In the step of preparing a molten salt, a molten salt containing an element having a trivalent or higher valence and being capable of taking a plurality of states of different valences is prepared. In the step of forming a plating film, with the substrate immersed in the molten salt, a plating film containing the element is formed on the surface of the substrate by a plating method. 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In the step of preparing a molten salt, a molten salt containing an element having a trivalent or higher valence and being capable of taking a plurality of states of different valences is prepared. In the step of forming a plating film, with the substrate immersed in the molten salt, a plating film containing the element is formed on the surface of the substrate by a plating method. In the plating step, a step (S21) of growing the plating film on the surface of the substrate by electrifying between the substrate and the molten salt and a step (S22) of adjusting growing conditions for the plating film after stopping the step of growing the plating film are repeated alternately.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | APPARATUS THEREFOR CHEMISTRY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS |
| title | STRUCTURE AND METHOD OF PRODUCING THE SAME |
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