ETCHING APPARATUS AND ETCHING TREATMENT METHOD

ETCHING APPARATUS AND ETCHING TREATMENT METHOD

PROBLEM TO BE SOLVED: To provide a contact piece for a precise electrification test, and the like by performing etching uniformly.SOLUTION: An etching apparatus for a processing object 10 which is a slender member having a resist layer formed on at least a portion of a surface thereof, performs etch...

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Hauptverfasser: HIROBE KOSUKE, HIRAI KENSUKE
Format: Patent
Sprache:eng
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APPARATUS THEREFOR
CHEMISTRY
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS
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creator HIROBE KOSUKE
HIRAI KENSUKE
description PROBLEM TO BE SOLVED: To provide a contact piece for a precise electrification test, and the like by performing etching uniformly.SOLUTION: An etching apparatus for a processing object 10 which is a slender member having a resist layer formed on at least a portion of a surface thereof, performs etching by immersing the processing object 10 in an etchant. Etching is performed in a circumstance where an etching rate is different depending on a longitudinal position of the processing object 10 and, therefore, immersion time is set differently depending on the longitudinal position of the processing object 10.
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subjects APPARATUS THEREFOR
CHEMISTRY
ELECTROLYTIC OR ELECTROPHORETIC PROCESSES
METALLURGY
PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROMOBJECTS
title ETCHING APPARATUS AND ETCHING TREATMENT METHOD
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