CURABLE RESIN COMPOSITION AND CURED MATERIAL THEREFROM

PROBLEM TO BE SOLVED: To provide a resin composition extremely useful as a sealing material for an optical semiconductor (such as an LED product) having excellent lighting durability.SOLUTION: (1)Provided is a curable resin composition for sealing an optical semiconductor comprising an epoxy resin a...

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Bibliographische Detailangaben
Hauptverfasser:	AOKI SHIZUKA, SHIDARA RITSUKO, SASAKI TOMOE
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS SEMICONDUCTOR DEVICES THEIR PREPARATION OR CHEMICAL WORKING-UP
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a resin composition extremely useful as a sealing material for an optical semiconductor (such as an LED product) having excellent lighting durability.SOLUTION: (1)Provided is a curable resin composition for sealing an optical semiconductor comprising an epoxy resin and/or an epoxy resin curing agent and a surfactant whose surface tension at 25°C is 14 to 45 dyne/cm.(2) Also provided is a curable resin composition for sealing an optical semiconductor mentioned in the (1) in which the surfactant being polyether-modified polysiloxane.(3) Also provided is a curable resin composition for sealing an optical semiconductor mentioned in the (1) or (2) in which the polyether-modified polysiloxane being polyether-modified polysiloxane represented by formula (1).