WIRING MATERIAL WITH CONDUCTIVE PASTE AND PROCESS OF MANUFACTURING THE SAME, AND SOLAR CELL MODULE AND PROCESS OF MANUFACTURING THE SAME

WIRING MATERIAL WITH CONDUCTIVE PASTE AND PROCESS OF MANUFACTURING THE SAME, AND SOLAR CELL MODULE AND PROCESS OF MANUFACTURING THE SAME

PROBLEM TO BE SOLVED: To provide a solar cell module and such that may be easily manufactured in a small number of steps, whose warpage may be reduced.SOLUTION: The solar cell module includes: solar cells 2X, 2Y, 2Z having electrodes 12, 13; a base layer; a wiring material 3 at least on one surface...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
1. Verfasser: HANAI DAISUKE
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator HANAI DAISUKE
description PROBLEM TO BE SOLVED: To provide a solar cell module and such that may be easily manufactured in a small number of steps, whose warpage may be reduced.SOLUTION: The solar cell module includes: solar cells 2X, 2Y, 2Z having electrodes 12, 13; a base layer; a wiring material 3 at least on one surface of which a non-penetrating recess is formed; and a conductive paste hardening material 35. The conductive paste hardening material 35 is disposed at the recess and the electrodes 12, 13 and the conductive base layer are coupled through the conductive paste hardening material 35 disposed at the recess.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2014090111A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2014090111A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2014090111A3</originalsourceid><addsrcrecordid>eNqNyzEKwjAUgOEuDqLe4eGs0KhLx0f6YiNpUpIXO5YicRIt1EN4bKV4gE7_8v3L7NNqr-0ZamTyGg20miuQzpZRsr4SNBiYAG0JjXeSQgCnftpGhZLj9HJFELCm3cSCM-hBkjFQuzKamfM6W9z7x5g2_66yrSKW1T4Nry6NQ39Lz_TuLs0hF6e8yIUQeJyFvpgjPj8</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>WIRING MATERIAL WITH CONDUCTIVE PASTE AND PROCESS OF MANUFACTURING THE SAME, AND SOLAR CELL MODULE AND PROCESS OF MANUFACTURING THE SAME</title><source>esp@cenet</source><creator>HANAI DAISUKE</creator><creatorcontrib>HANAI DAISUKE</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a solar cell module and such that may be easily manufactured in a small number of steps, whose warpage may be reduced.SOLUTION: The solar cell module includes: solar cells 2X, 2Y, 2Z having electrodes 12, 13; a base layer; a wiring material 3 at least on one surface of which a non-penetrating recess is formed; and a conductive paste hardening material 35. The conductive paste hardening material 35 is disposed at the recess and the electrodes 12, 13 and the conductive base layer are coupled through the conductive paste hardening material 35 disposed at the recess.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; SEMICONDUCTOR DEVICES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140515&amp;DB=EPODOC&amp;CC=JP&amp;NR=2014090111A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140515&amp;DB=EPODOC&amp;CC=JP&amp;NR=2014090111A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>HANAI DAISUKE</creatorcontrib><title>WIRING MATERIAL WITH CONDUCTIVE PASTE AND PROCESS OF MANUFACTURING THE SAME, AND SOLAR CELL MODULE AND PROCESS OF MANUFACTURING THE SAME</title><description>PROBLEM TO BE SOLVED: To provide a solar cell module and such that may be easily manufactured in a small number of steps, whose warpage may be reduced.SOLUTION: The solar cell module includes: solar cells 2X, 2Y, 2Z having electrodes 12, 13; a base layer; a wiring material 3 at least on one surface of which a non-penetrating recess is formed; and a conductive paste hardening material 35. The conductive paste hardening material 35 is disposed at the recess and the electrodes 12, 13 and the conductive base layer are coupled through the conductive paste hardening material 35 disposed at the recess.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNqNyzEKwjAUgOEuDqLe4eGs0KhLx0f6YiNpUpIXO5YicRIt1EN4bKV4gE7_8v3L7NNqr-0ZamTyGg20miuQzpZRsr4SNBiYAG0JjXeSQgCnftpGhZLj9HJFELCm3cSCM-hBkjFQuzKamfM6W9z7x5g2_66yrSKW1T4Nry6NQ39Lz_TuLs0hF6e8yIUQeJyFvpgjPj8</recordid><startdate>20140515</startdate><enddate>20140515</enddate><creator>HANAI DAISUKE</creator><scope>EVB</scope></search><sort><creationdate>20140515</creationdate><title>WIRING MATERIAL WITH CONDUCTIVE PASTE AND PROCESS OF MANUFACTURING THE SAME, AND SOLAR CELL MODULE AND PROCESS OF MANUFACTURING THE SAME</title><author>HANAI DAISUKE</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2014090111A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>HANAI DAISUKE</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>HANAI DAISUKE</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WIRING MATERIAL WITH CONDUCTIVE PASTE AND PROCESS OF MANUFACTURING THE SAME, AND SOLAR CELL MODULE AND PROCESS OF MANUFACTURING THE SAME</title><date>2014-05-15</date><risdate>2014</risdate><abstract>PROBLEM TO BE SOLVED: To provide a solar cell module and such that may be easily manufactured in a small number of steps, whose warpage may be reduced.SOLUTION: The solar cell module includes: solar cells 2X, 2Y, 2Z having electrodes 12, 13; a base layer; a wiring material 3 at least on one surface of which a non-penetrating recess is formed; and a conductive paste hardening material 35. The conductive paste hardening material 35 is disposed at the recess and the electrodes 12, 13 and the conductive base layer are coupled through the conductive paste hardening material 35 disposed at the recess.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2014090111A
source esp@cenet
subjects BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
title WIRING MATERIAL WITH CONDUCTIVE PASTE AND PROCESS OF MANUFACTURING THE SAME, AND SOLAR CELL MODULE AND PROCESS OF MANUFACTURING THE SAME
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2024-12-26T10%3A36%3A41IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=HANAI%20DAISUKE&rft.date=2014-05-15&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2014090111A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true