APPARATUS FOR COPPER ELECTROPLATING

PROBLEM TO BE SOLVED: To provide an apparatus for copper electroplating that can exhibit an excellent suppression effect of surface plating.SOLUTION: Provided is an apparatus for copper electroplating that comprises a single tank 120 comprising a cathode 121, an insoluble anode 122, copper balls 125 and a plating solution 123, in which the plating solution contains manganese oxide. Also provided is an apparatus for copper electroplating that comprises a main tank 123 comprising the cathode 121, the insoluble anode 122 and the plating solution 123, and a dissolving tank 120 comprising the copper balls 125 and a manganese oxide 126. The apparatus having this structure can exhibit an excellent suppression effect of surface plating, even applied under a low concentration, by utilizing the manganese oxide 126 having a higher redox potential, in stead of the conventional Fe, as a copper source in an apparatus for copper electroplating. The manganese oxide is selected from KMnOor NaMnOin a concentration of 0.1 to 10 g/L. The plating solution comprises copper sulfate of 50 to 350 g/L, sulfuric acid of 10 to 150 g/L, and chlorine of 10 to 200 mg/L.