CIRCUIT BOARD, ELECTRONIC APPARATUS, AND CIRCUIT BOARD MANUFACTURING METHOD

CIRCUIT BOARD, ELECTRONIC APPARATUS, AND CIRCUIT BOARD MANUFACTURING METHOD

PROBLEM TO BE SOLVED: To provide a circuit board, an electronic apparatus and a circuit board manufacturing method capable of taking countermeasures for surges easily while also restraining an increase in manufacturing costs.SOLUTION: A circuit board 10 comprises a first wiring pattern 51 to which a...

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Hauptverfasser: HIRABAYASHI KATSUJI, OTSUKA SHINYA
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Sprache:eng
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CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
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creator HIRABAYASHI KATSUJI
OTSUKA SHINYA
description PROBLEM TO BE SOLVED: To provide a circuit board, an electronic apparatus and a circuit board manufacturing method capable of taking countermeasures for surges easily while also restraining an increase in manufacturing costs.SOLUTION: A circuit board 10 comprises a first wiring pattern 51 to which a signal or power supply voltage is input, a second wiring pattern 52 connected to ground, and a through hole 60 formed at a position spanning the first wiring pattern 51 and the second wiring pattern 52 and having no conductive material formed on the inner surface of the hole. The formation of this through hole 60 results in the first wiring pattern 51 and the second wiring pattern 52 being partly cut off, whereby a discharge path mediated via the through hole 60 is formed.
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subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title CIRCUIT BOARD, ELECTRONIC APPARATUS, AND CIRCUIT BOARD MANUFACTURING METHOD
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