RADIATOR
PROBLEM TO BE SOLVED: To provide a radiator capable of achieving favorable heat radiation efficiency by improving heat transfer efficiency in each part without enlarging the radiator in whole.SOLUTION: A radiator includes a base part 10 receiving heat from a heating element, heat radiation bodies 30...
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creator | KONNO YOSHIHISA SUTANI JUNJI MURASE TAKASHI HONDA YUJI |
description | PROBLEM TO BE SOLVED: To provide a radiator capable of achieving favorable heat radiation efficiency by improving heat transfer efficiency in each part without enlarging the radiator in whole.SOLUTION: A radiator includes a base part 10 receiving heat from a heating element, heat radiation bodies 30, 31 having a plurality of radiation fins 32 and radiating the heat, and a heat pipe 20 having a heat receiving portion 21 in contact with the base part and a heat radiation portion 22 in contact with heat radiation bodies 30, 31. The heat radiation portion of the heat pipe 20 has flat shape having a flat surface 23 in contact with the heat radiation bodies 30, 31. |
format | Patent |
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The heat radiation portion of the heat pipe 20 has flat shape having a flat surface 23 in contact with the heat radiation bodies 30, 31.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; BLASTING ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; HEAT EXCHANGE IN GENERAL ; HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT ; HEATING ; LIGHTING ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; MECHANICAL ENGINEERING ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES ; WEAPONS</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140220&DB=EPODOC&CC=JP&NR=2014031912A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140220&DB=EPODOC&CC=JP&NR=2014031912A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KONNO YOSHIHISA</creatorcontrib><creatorcontrib>SUTANI JUNJI</creatorcontrib><creatorcontrib>MURASE TAKASHI</creatorcontrib><creatorcontrib>HONDA YUJI</creatorcontrib><title>RADIATOR</title><description>PROBLEM TO BE SOLVED: To provide a radiator capable of achieving favorable heat radiation efficiency by improving heat transfer efficiency in each part without enlarging the radiator in whole.SOLUTION: A radiator includes a base part 10 receiving heat from a heating element, heat radiation bodies 30, 31 having a plurality of radiation fins 32 and radiating the heat, and a heat pipe 20 having a heat receiving portion 21 in contact with the base part and a heat radiation portion 22 in contact with heat radiation bodies 30, 31. The heat radiation portion of the heat pipe 20 has flat shape having a flat surface 23 in contact with the heat radiation bodies 30, 31.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>BLASTING</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>HEAT EXCHANGE IN GENERAL</subject><subject>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</subject><subject>HEATING</subject><subject>LIGHTING</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>MECHANICAL ENGINEERING</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>WEAPONS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAIcnTxdAzxD-JhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhiYGxoaWhkaOxkQpAgBV9hun</recordid><startdate>20140220</startdate><enddate>20140220</enddate><creator>KONNO YOSHIHISA</creator><creator>SUTANI JUNJI</creator><creator>MURASE TAKASHI</creator><creator>HONDA YUJI</creator><scope>EVB</scope></search><sort><creationdate>20140220</creationdate><title>RADIATOR</title><author>KONNO YOSHIHISA ; SUTANI JUNJI ; MURASE TAKASHI ; HONDA YUJI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2014031912A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>BLASTING</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>HEAT EXCHANGE IN GENERAL</topic><topic>HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT</topic><topic>HEATING</topic><topic>LIGHTING</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>MECHANICAL ENGINEERING</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>WEAPONS</topic><toplevel>online_resources</toplevel><creatorcontrib>KONNO YOSHIHISA</creatorcontrib><creatorcontrib>SUTANI JUNJI</creatorcontrib><creatorcontrib>MURASE TAKASHI</creatorcontrib><creatorcontrib>HONDA YUJI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KONNO YOSHIHISA</au><au>SUTANI JUNJI</au><au>MURASE TAKASHI</au><au>HONDA YUJI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>RADIATOR</title><date>2014-02-20</date><risdate>2014</risdate><abstract>PROBLEM TO BE SOLVED: To provide a radiator capable of achieving favorable heat radiation efficiency by improving heat transfer efficiency in each part without enlarging the radiator in whole.SOLUTION: A radiator includes a base part 10 receiving heat from a heating element, heat radiation bodies 30, 31 having a plurality of radiation fins 32 and radiating the heat, and a heat pipe 20 having a heat receiving portion 21 in contact with the base part and a heat radiation portion 22 in contact with heat radiation bodies 30, 31. The heat radiation portion of the heat pipe 20 has flat shape having a flat surface 23 in contact with the heat radiation bodies 30, 31.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | BASIC ELECTRIC ELEMENTS BLASTING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY HEAT EXCHANGE IN GENERAL HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS,IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT HEATING LIGHTING MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS MECHANICAL ENGINEERING PRINTED CIRCUITS SEMICONDUCTOR DEVICES WEAPONS |
title | RADIATOR |
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