ELECTRONIC APPARATUS

PROBLEM TO BE SOLVED: To reduce thickness of a housing of an electronic apparatus, and to simplify wiring in the housing.SOLUTION: A substrate 22 (a substrate body 30) is disposed without being overlapped with internal devices (an HDD24, an ODD26, and a heat radiator 28), and a substrate extension p...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	TAMURA YOSHIRO, HOSHI MASAHIKO, TAKIZAWA EIJI
Format:	Patent
Sprache:	eng
Schlagworte:	CALCULATING CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS COMPUTING COUNTING ELECTRIC DIGITAL DATA PROCESSING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PHYSICS PRINTED CIRCUITS
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