HIGH EMISSIVITY METAL FOIL

PROBLEM TO BE SOLVED: To provide metal foil for heat dissipation including electrical-electronic fields, which has excellent heat dissipation and thermal conductivity and has excellent flexibility.SOLUTION: In the metal foil, substrate metal foil is made of copper, aluminum, nickel, iron or stainles...

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Bibliographische Detailangaben
1. Verfasser:	TAKAMI MASATO
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METALLURGY PRINTED CIRCUITS PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS
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Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide metal foil for heat dissipation including electrical-electronic fields, which has excellent heat dissipation and thermal conductivity and has excellent flexibility.SOLUTION: In the metal foil, substrate metal foil is made of copper, aluminum, nickel, iron or stainless steel, at least one side of the substrate metal foil is stuck with nickel or cobalt fine particles and/or its aggregate, the surface thereof is provided with an alloy covering layer composed of one or more kinds selected from Co, Ni, Fe, Cu, P, Zn and Sn. The metal foil has a fine particle roughened face with a grain size of 0.1 to 2 μm, and has an emissivity of 0.40 or higher.