PLATING DEVICE AND SUBSTRATE HOLDER CLEANING METHOD

PROBLEM TO BE SOLVED: To clean a substrate with a cleaning fluid without removing the substrate holder from a plating device, further, without wetting an electrical contact provided in the substrate holder, while driving the plating device.SOLUTION: The plating device comprises: a plating tank of ho...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	FUJIKATA JUNPEI, SHIMOYAMA TADASHI
Format:	Patent
Sprache:	eng
Schlagworte:	APPARATUS THEREFOR CHEMISTRY CLEANING CLEANING IN GENERAL ELECTROFORMING ELECTROLYTIC OR ELECTROPHORETIC PROCESSES METALLURGY PERFORMING OPERATIONS PREVENTION OF FOULING IN GENERAL PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS TRANSPORTING
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!