CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF
PROBLEM TO BE SOLVED: To provide a resin composition which can achieve a cured product having low viscosity and good flowability, and exhibiting low thermal expansion properties.SOLUTION: The resin composition comprises an alicyclic condensed epoxy compound (A) having two or more epoxy groups in a m...
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| creator | SUGANO YUICHI IKENO TAKETO TSUFUKU AKIRA TOKUZUMI KEITA KATAGIRI MASAYUKI |
| description | PROBLEM TO BE SOLVED: To provide a resin composition which can achieve a cured product having low viscosity and good flowability, and exhibiting low thermal expansion properties.SOLUTION: The resin composition comprises an alicyclic condensed epoxy compound (A) having two or more epoxy groups in a molecule, a cyanate compound (B) and a curing accelerator (C). |
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| subjects | ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE ADHESIVES CHEMICAL PAINT OR INK REMOVERS CHEMISTRY COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS COMPOSITIONS BASED THEREON CORRECTING FLUIDS DYES FILLING PASTES INKS LAYERED PRODUCTS LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS METALLURGY MISCELLANEOUS APPLICATIONS OF MATERIALS MISCELLANEOUS COMPOSITIONS NATURAL RESINS NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL ORGANIC MACROMOLECULAR COMPOUNDS PAINTS PASTES OR SOLIDS FOR COLOURING OR PRINTING PERFORMING OPERATIONS POLISHES THEIR PREPARATION OR CHEMICAL WORKING-UP TRANSPORTING USE OF MATERIALS AS ADHESIVES USE OF MATERIALS THEREFOR WOODSTAINS |
| title | CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF |
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