ELECTRONIC DEVICE
PROBLEM TO BE SOLVED: To provide an electronic device capable of reliably fixing a print wiring substrate in a case with a structure constituted of an upper case and a lower case irrespective of dispersion of the thickness of the print wiring substrate.SOLUTION: When a boss formed in an upper case i...
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creator | SASAKI KOICHI HIRANO ARATA |
description | PROBLEM TO BE SOLVED: To provide an electronic device capable of reliably fixing a print wiring substrate in a case with a structure constituted of an upper case and a lower case irrespective of dispersion of the thickness of the print wiring substrate.SOLUTION: When a boss formed in an upper case is inserted into a mounting hole in the print wiring substrate, the print wiring substrate is pressed onto an engagement concave portion formed in a lower case and then the diameter of the mounting hole is reduced. In a state that the print wiring substrate is pressed onto the engagement concave portion, the engagement concave portion is engaged with the mounting hole by reducing the diameter. The print wiring substrate is fixed being pressed onto the engagement concave portion with an elastic force generated due to the diameter reduction which is given to the corner of the mounting hole. With this, the print wiring substrate can be reliably fixed in the case irrespective of dispersion of the thickness of the print wiring substrate. |
format | Patent |
fullrecord | <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2014017435A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2014017435A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2014017435A3</originalsourceid><addsrcrecordid>eNrjZBB09XF1Dgny9_N0VnBxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhiYGhuYmxqaOxkQpAgBSWh4a</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>ELECTRONIC DEVICE</title><source>esp@cenet</source><creator>SASAKI KOICHI ; HIRANO ARATA</creator><creatorcontrib>SASAKI KOICHI ; HIRANO ARATA</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide an electronic device capable of reliably fixing a print wiring substrate in a case with a structure constituted of an upper case and a lower case irrespective of dispersion of the thickness of the print wiring substrate.SOLUTION: When a boss formed in an upper case is inserted into a mounting hole in the print wiring substrate, the print wiring substrate is pressed onto an engagement concave portion formed in a lower case and then the diameter of the mounting hole is reduced. In a state that the print wiring substrate is pressed onto the engagement concave portion, the engagement concave portion is engaged with the mounting hole by reducing the diameter. The print wiring substrate is fixed being pressed onto the engagement concave portion with an elastic force generated due to the diameter reduction which is given to the corner of the mounting hole. With this, the print wiring substrate can be reliably fixed in the case irrespective of dispersion of the thickness of the print wiring substrate.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140130&DB=EPODOC&CC=JP&NR=2014017435A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140130&DB=EPODOC&CC=JP&NR=2014017435A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>SASAKI KOICHI</creatorcontrib><creatorcontrib>HIRANO ARATA</creatorcontrib><title>ELECTRONIC DEVICE</title><description>PROBLEM TO BE SOLVED: To provide an electronic device capable of reliably fixing a print wiring substrate in a case with a structure constituted of an upper case and a lower case irrespective of dispersion of the thickness of the print wiring substrate.SOLUTION: When a boss formed in an upper case is inserted into a mounting hole in the print wiring substrate, the print wiring substrate is pressed onto an engagement concave portion formed in a lower case and then the diameter of the mounting hole is reduced. In a state that the print wiring substrate is pressed onto the engagement concave portion, the engagement concave portion is engaged with the mounting hole by reducing the diameter. The print wiring substrate is fixed being pressed onto the engagement concave portion with an elastic force generated due to the diameter reduction which is given to the corner of the mounting hole. With this, the print wiring substrate can be reliably fixed in the case irrespective of dispersion of the thickness of the print wiring substrate.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZBB09XF1Dgny9_N0VnBxDfN0duVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhiYGhuYmxqaOxkQpAgBSWh4a</recordid><startdate>20140130</startdate><enddate>20140130</enddate><creator>SASAKI KOICHI</creator><creator>HIRANO ARATA</creator><scope>EVB</scope></search><sort><creationdate>20140130</creationdate><title>ELECTRONIC DEVICE</title><author>SASAKI KOICHI ; HIRANO ARATA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2014017435A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>SASAKI KOICHI</creatorcontrib><creatorcontrib>HIRANO ARATA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>SASAKI KOICHI</au><au>HIRANO ARATA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>ELECTRONIC DEVICE</title><date>2014-01-30</date><risdate>2014</risdate><abstract>PROBLEM TO BE SOLVED: To provide an electronic device capable of reliably fixing a print wiring substrate in a case with a structure constituted of an upper case and a lower case irrespective of dispersion of the thickness of the print wiring substrate.SOLUTION: When a boss formed in an upper case is inserted into a mounting hole in the print wiring substrate, the print wiring substrate is pressed onto an engagement concave portion formed in a lower case and then the diameter of the mounting hole is reduced. In a state that the print wiring substrate is pressed onto the engagement concave portion, the engagement concave portion is engaged with the mounting hole by reducing the diameter. The print wiring substrate is fixed being pressed onto the engagement concave portion with an elastic force generated due to the diameter reduction which is given to the corner of the mounting hole. With this, the print wiring substrate can be reliably fixed in the case irrespective of dispersion of the thickness of the print wiring substrate.</abstract><oa>free_for_read</oa></addata></record> |
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subjects | CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS |
title | ELECTRONIC DEVICE |
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