METHOD AND APPARATUS FOR SUPPLYING FLUX FREE SOLDER TO SUBSTRATE
PROBLEM TO BE SOLVED: To supply a solder, which has a predetermined thickness and is evenly distributed throughout the entire surface of a semiconductor chip when the semiconductor chip is mounted on a metal substrate, also called a lead frame.SOLUTION: An apparatus for supplying a flux free solder...
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| creator | RENE BETSCHART BERCHTOLD HEINRICH |
| description | PROBLEM TO BE SOLVED: To supply a solder, which has a predetermined thickness and is evenly distributed throughout the entire surface of a semiconductor chip when the semiconductor chip is mounted on a metal substrate, also called a lead frame.SOLUTION: An apparatus for supplying a flux free solder comprises a dispenser head 2 having a stamp 5 that can irradiate an ultrasonic wave. A method for supplying solder comprises the steps of A) moving the dispenser head 2 above the next substrate portion, B) moving down the stamp 5 until an operation surface 11 comes into contact with the substrate portion, C) supplying solder in such a manner as to C1) feed the tip of a solder wire comes into contact with the substrate portion in a concave part 12 of the stamp 5, C2) feed the solder wire 8 further so that a predetermined amount of the solder is melted, and C3) pull back the solder wire 8, D) irradiating the ultrasonic wave on the stamp 5, and E) moving up the stamp 5. |
| format | Patent |
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A method for supplying solder comprises the steps of A) moving the dispenser head 2 above the next substrate portion, B) moving down the stamp 5 until an operation surface 11 comes into contact with the substrate portion, C) supplying solder in such a manner as to C1) feed the tip of a solder wire comes into contact with the substrate portion in a concave part 12 of the stamp 5, C2) feed the solder wire 8 further so that a predetermined amount of the solder is melted, and C3) pull back the solder wire 8, D) irradiating the ultrasonic wave on the stamp 5, and E) moving up the stamp 5.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MACHINE TOOLS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; PERFORMING OPERATIONS ; SEMICONDUCTOR DEVICES ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140130&DB=EPODOC&CC=JP&NR=2014014868A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76289</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20140130&DB=EPODOC&CC=JP&NR=2014014868A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>RENE BETSCHART</creatorcontrib><creatorcontrib>BERCHTOLD HEINRICH</creatorcontrib><title>METHOD AND APPARATUS FOR SUPPLYING FLUX FREE SOLDER TO SUBSTRATE</title><description>PROBLEM TO BE SOLVED: To supply a solder, which has a predetermined thickness and is evenly distributed throughout the entire surface of a semiconductor chip when the semiconductor chip is mounted on a metal substrate, also called a lead frame.SOLUTION: An apparatus for supplying a flux free solder comprises a dispenser head 2 having a stamp 5 that can irradiate an ultrasonic wave. A method for supplying solder comprises the steps of A) moving the dispenser head 2 above the next substrate portion, B) moving down the stamp 5 until an operation surface 11 comes into contact with the substrate portion, C) supplying solder in such a manner as to C1) feed the tip of a solder wire comes into contact with the substrate portion in a concave part 12 of the stamp 5, C2) feed the solder wire 8 further so that a predetermined amount of the solder is melted, and C3) pull back the solder wire 8, D) irradiating the ultrasonic wave on the stamp 5, and E) moving up the stamp 5.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MACHINE TOOLS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>PERFORMING OPERATIONS</subject><subject>SEMICONDUCTOR DEVICES</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHDwdQ3x8HdRcPQD4oAAxyDHkNBgBTf_IIXg0IAAn0hPP3cFN5_QCAW3IFdXhWB_HxfXIIUQf6CsU3AIULErDwNrWmJOcSovlOZmUHJzDXH20E0tyI9PLS5ITE7NSy2J9wowMjA0ASILMwtHY6IUAQAM6CtA</recordid><startdate>20140130</startdate><enddate>20140130</enddate><creator>RENE BETSCHART</creator><creator>BERCHTOLD HEINRICH</creator><scope>EVB</scope></search><sort><creationdate>20140130</creationdate><title>METHOD AND APPARATUS FOR SUPPLYING FLUX FREE SOLDER TO SUBSTRATE</title><author>RENE BETSCHART ; BERCHTOLD HEINRICH</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2014014868A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MACHINE TOOLS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>PERFORMING OPERATIONS</topic><topic>SEMICONDUCTOR DEVICES</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>RENE BETSCHART</creatorcontrib><creatorcontrib>BERCHTOLD HEINRICH</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>RENE BETSCHART</au><au>BERCHTOLD HEINRICH</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD AND APPARATUS FOR SUPPLYING FLUX FREE SOLDER TO SUBSTRATE</title><date>2014-01-30</date><risdate>2014</risdate><abstract>PROBLEM TO BE SOLVED: To supply a solder, which has a predetermined thickness and is evenly distributed throughout the entire surface of a semiconductor chip when the semiconductor chip is mounted on a metal substrate, also called a lead frame.SOLUTION: An apparatus for supplying a flux free solder comprises a dispenser head 2 having a stamp 5 that can irradiate an ultrasonic wave. A method for supplying solder comprises the steps of A) moving the dispenser head 2 above the next substrate portion, B) moving down the stamp 5 until an operation surface 11 comes into contact with the substrate portion, C) supplying solder in such a manner as to C1) feed the tip of a solder wire comes into contact with the substrate portion in a concave part 12 of the stamp 5, C2) feed the solder wire 8 further so that a predetermined amount of the solder is melted, and C3) pull back the solder wire 8, D) irradiating the ultrasonic wave on the stamp 5, and E) moving up the stamp 5.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | BASIC ELECTRIC ELEMENTS CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR PERFORMING OPERATIONS SEMICONDUCTOR DEVICES SOLDERING OR UNSOLDERING TRANSPORTING WELDING WORKING BY LASER BEAM |
| title | METHOD AND APPARATUS FOR SUPPLYING FLUX FREE SOLDER TO SUBSTRATE |
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