HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS

PROBLEM TO BE SOLVED: To provide a heat treatment method and a heat treatment apparatus capable of performing light irradiation heating of a workpiece, without damaging a resin contained in the workpiece.SOLUTION: Between a holding plate 20 and a flash lamp FL in a chamber 10, an optical filter 60 f...

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Hauptverfasser: KIMURA TAKAHIRO, SHIBUTA KOJI, KUWATA YUTAKA
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creator KIMURA TAKAHIRO
SHIBUTA KOJI
KUWATA YUTAKA
description PROBLEM TO BE SOLVED: To provide a heat treatment method and a heat treatment apparatus capable of performing light irradiation heating of a workpiece, without damaging a resin contained in the workpiece.SOLUTION: Between a holding plate 20 and a flash lamp FL in a chamber 10, an optical filter 60 for cutting ultraviolet light having a wavelength of 400 nm or less is disposed. When the flash light emitted from the flash lamp FL passes through the optical filter 60, ultraviolet light in a wavelength region of 400 nm or less is cut. A processed workpiece 8 is composed by laminating a functional layer on the upper surface of a resin substrate. By irradiating the workpiece 8 with the light, obtained by cutting ultraviolet light having a wavelength of 400 nm or less from the flash light having an extremely short irradiation time, desired heat treatment can be carried out by raising the temperature only of the functional layer up to a required processing temperature, without giving a damage due to ultraviolet light and a thermal damage on the resin substrate.
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fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2014011256A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2014011256A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2014011256A3</originalsourceid><addsrcrecordid>eNrjZDDycHUMUQgJApK-rn4hCr6uIR7-LgqOfi4KaDKOAQGOQY4hocE8DKxpiTnFqbxQmptByc01xNlDN7UgPz61uCAxOTUvtSTeK8DIwNDEwNDQyNTM0ZgoRQC8iicq</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS</title><source>esp@cenet</source><creator>KIMURA TAKAHIRO ; SHIBUTA KOJI ; KUWATA YUTAKA</creator><creatorcontrib>KIMURA TAKAHIRO ; SHIBUTA KOJI ; KUWATA YUTAKA</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a heat treatment method and a heat treatment apparatus capable of performing light irradiation heating of a workpiece, without damaging a resin contained in the workpiece.SOLUTION: Between a holding plate 20 and a flash lamp FL in a chamber 10, an optical filter 60 for cutting ultraviolet light having a wavelength of 400 nm or less is disposed. When the flash light emitted from the flash lamp FL passes through the optical filter 60, ultraviolet light in a wavelength region of 400 nm or less is cut. A processed workpiece 8 is composed by laminating a functional layer on the upper surface of a resin substrate. By irradiating the workpiece 8 with the light, obtained by cutting ultraviolet light having a wavelength of 400 nm or less from the flash light having an extremely short irradiation time, desired heat treatment can be carried out by raising the temperature only of the functional layer up to a required processing temperature, without giving a damage due to ultraviolet light and a thermal damage on the resin substrate.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS ; SEMICONDUCTOR DEVICES</subject><creationdate>2014</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140120&amp;DB=EPODOC&amp;CC=JP&amp;NR=2014011256A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20140120&amp;DB=EPODOC&amp;CC=JP&amp;NR=2014011256A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KIMURA TAKAHIRO</creatorcontrib><creatorcontrib>SHIBUTA KOJI</creatorcontrib><creatorcontrib>KUWATA YUTAKA</creatorcontrib><title>HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS</title><description>PROBLEM TO BE SOLVED: To provide a heat treatment method and a heat treatment apparatus capable of performing light irradiation heating of a workpiece, without damaging a resin contained in the workpiece.SOLUTION: Between a holding plate 20 and a flash lamp FL in a chamber 10, an optical filter 60 for cutting ultraviolet light having a wavelength of 400 nm or less is disposed. When the flash light emitted from the flash lamp FL passes through the optical filter 60, ultraviolet light in a wavelength region of 400 nm or less is cut. A processed workpiece 8 is composed by laminating a functional layer on the upper surface of a resin substrate. By irradiating the workpiece 8 with the light, obtained by cutting ultraviolet light having a wavelength of 400 nm or less from the flash light having an extremely short irradiation time, desired heat treatment can be carried out by raising the temperature only of the functional layer up to a required processing temperature, without giving a damage due to ultraviolet light and a thermal damage on the resin substrate.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><subject>SEMICONDUCTOR DEVICES</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2014</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZDDycHUMUQgJApK-rn4hCr6uIR7-LgqOfi4KaDKOAQGOQY4hocE8DKxpiTnFqbxQmptByc01xNlDN7UgPz61uCAxOTUvtSTeK8DIwNDEwNDQyNTM0ZgoRQC8iicq</recordid><startdate>20140120</startdate><enddate>20140120</enddate><creator>KIMURA TAKAHIRO</creator><creator>SHIBUTA KOJI</creator><creator>KUWATA YUTAKA</creator><scope>EVB</scope></search><sort><creationdate>20140120</creationdate><title>HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS</title><author>KIMURA TAKAHIRO ; SHIBUTA KOJI ; KUWATA YUTAKA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2014011256A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2014</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><topic>SEMICONDUCTOR DEVICES</topic><toplevel>online_resources</toplevel><creatorcontrib>KIMURA TAKAHIRO</creatorcontrib><creatorcontrib>SHIBUTA KOJI</creatorcontrib><creatorcontrib>KUWATA YUTAKA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KIMURA TAKAHIRO</au><au>SHIBUTA KOJI</au><au>KUWATA YUTAKA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS</title><date>2014-01-20</date><risdate>2014</risdate><abstract>PROBLEM TO BE SOLVED: To provide a heat treatment method and a heat treatment apparatus capable of performing light irradiation heating of a workpiece, without damaging a resin contained in the workpiece.SOLUTION: Between a holding plate 20 and a flash lamp FL in a chamber 10, an optical filter 60 for cutting ultraviolet light having a wavelength of 400 nm or less is disposed. When the flash light emitted from the flash lamp FL passes through the optical filter 60, ultraviolet light in a wavelength region of 400 nm or less is cut. A processed workpiece 8 is composed by laminating a functional layer on the upper surface of a resin substrate. By irradiating the workpiece 8 with the light, obtained by cutting ultraviolet light having a wavelength of 400 nm or less from the flash light having an extremely short irradiation time, desired heat treatment can be carried out by raising the temperature only of the functional layer up to a required processing temperature, without giving a damage due to ultraviolet light and a thermal damage on the resin substrate.</abstract><oa>free_for_read</oa></addata></record>
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subjects BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
title HEAT TREATMENT METHOD AND HEAT TREATMENT APPARATUS
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-02T16%3A53%3A46IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KIMURA%20TAKAHIRO&rft.date=2014-01-20&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2014011256A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true