METHOD OF MANUFACTURING ELECTRONIC DEVICE BY LASER HEATING METHOD
PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device using a bonding material which can eliminate burning of an electronic component, a substrate, and the like, incident to reflection of a laser beam.SOLUTION: In the method of manufacturing an electronic device including a...
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| creator | TANAKA NORIHITO KASHIWAGI TOSHINORI |
| description | PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device using a bonding material which can eliminate burning of an electronic component, a substrate, and the like, incident to reflection of a laser beam.SOLUTION: In the method of manufacturing an electronic device including a step for heating at least two members with laser light 5 and bonding them by a molten bonding material, the average specular reflectance is 40% or less for a light beam of 500-1000 nm impinging on the surface at an angle of 5 degree, at a bonded portion formed by raising the temperature of the bonding material to 250°C and then cooling the bonding material down to the room temperature. The bonding material 4 contains a solder component, and particles having a melting point higher than that of the solder component. Since the laser heating method can be used for mounting various electronic components, the degree of freedom can be enhanced in the manufacturing of an electronic device. |
| format | Patent |
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The bonding material 4 contains a solder component, and particles having a melting point higher than that of the solder component. Since the laser heating method can be used for mounting various electronic components, the degree of freedom can be enhanced in the manufacturing of an electronic device.</description><language>eng</language><subject>ALLOYS ; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; CHEMISTRY ; CLADDING OR PLATING BY SOLDERING OR WELDING ; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; FERROUS OR NON-FERROUS ALLOYS ; MACHINE TOOLS ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; METAL-WORKING NOT OTHERWISE PROVIDED FOR ; METALLURGY ; PERFORMING OPERATIONS ; PRINTED CIRCUITS ; SOLDERING OR UNSOLDERING ; TRANSPORTING ; TREATMENT OF ALLOYS OR NON-FERROUS METALS ; WELDING ; WORKING BY LASER BEAM</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20131226&DB=EPODOC&CC=JP&NR=2013258254A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,780,885,25564,76547</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20131226&DB=EPODOC&CC=JP&NR=2013258254A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>TANAKA NORIHITO</creatorcontrib><creatorcontrib>KASHIWAGI TOSHINORI</creatorcontrib><title>METHOD OF MANUFACTURING ELECTRONIC DEVICE BY LASER HEATING METHOD</title><description>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device using a bonding material which can eliminate burning of an electronic component, a substrate, and the like, incident to reflection of a laser beam.SOLUTION: In the method of manufacturing an electronic device including a step for heating at least two members with laser light 5 and bonding them by a molten bonding material, the average specular reflectance is 40% or less for a light beam of 500-1000 nm impinging on the surface at an angle of 5 degree, at a bonded portion formed by raising the temperature of the bonding material to 250°C and then cooling the bonding material down to the room temperature. The bonding material 4 contains a solder component, and particles having a melting point higher than that of the solder component. Since the laser heating method can be used for mounting various electronic components, the degree of freedom can be enhanced in the manufacturing of an electronic device.</description><subject>ALLOYS</subject><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>CHEMISTRY</subject><subject>CLADDING OR PLATING BY SOLDERING OR WELDING</subject><subject>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>FERROUS OR NON-FERROUS ALLOYS</subject><subject>MACHINE TOOLS</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>METAL-WORKING NOT OTHERWISE PROVIDED FOR</subject><subject>METALLURGY</subject><subject>PERFORMING OPERATIONS</subject><subject>PRINTED CIRCUITS</subject><subject>SOLDERING OR UNSOLDERING</subject><subject>TRANSPORTING</subject><subject>TREATMENT OF ALLOYS OR NON-FERROUS METALS</subject><subject>WELDING</subject><subject>WORKING BY LASER BEAM</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHD0dQ3x8HdR8HdT8HX0C3VzdA4JDfL0c1dw9XF1Dgny9_N0VnBxDfN0dlVwilTwcQx2DVLwcHUMASmBaOVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhsZGphZGpiaOxkQpAgAXjSsx</recordid><startdate>20131226</startdate><enddate>20131226</enddate><creator>TANAKA NORIHITO</creator><creator>KASHIWAGI TOSHINORI</creator><scope>EVB</scope></search><sort><creationdate>20131226</creationdate><title>METHOD OF MANUFACTURING ELECTRONIC DEVICE BY LASER HEATING METHOD</title><author>TANAKA NORIHITO ; KASHIWAGI TOSHINORI</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2013258254A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>ALLOYS</topic><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>CHEMISTRY</topic><topic>CLADDING OR PLATING BY SOLDERING OR WELDING</topic><topic>CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>FERROUS OR NON-FERROUS ALLOYS</topic><topic>MACHINE TOOLS</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>METAL-WORKING NOT OTHERWISE PROVIDED FOR</topic><topic>METALLURGY</topic><topic>PERFORMING OPERATIONS</topic><topic>PRINTED CIRCUITS</topic><topic>SOLDERING OR UNSOLDERING</topic><topic>TRANSPORTING</topic><topic>TREATMENT OF ALLOYS OR NON-FERROUS METALS</topic><topic>WELDING</topic><topic>WORKING BY LASER BEAM</topic><toplevel>online_resources</toplevel><creatorcontrib>TANAKA NORIHITO</creatorcontrib><creatorcontrib>KASHIWAGI TOSHINORI</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>TANAKA NORIHITO</au><au>KASHIWAGI TOSHINORI</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>METHOD OF MANUFACTURING ELECTRONIC DEVICE BY LASER HEATING METHOD</title><date>2013-12-26</date><risdate>2013</risdate><abstract>PROBLEM TO BE SOLVED: To provide a method of manufacturing an electronic device using a bonding material which can eliminate burning of an electronic component, a substrate, and the like, incident to reflection of a laser beam.SOLUTION: In the method of manufacturing an electronic device including a step for heating at least two members with laser light 5 and bonding them by a molten bonding material, the average specular reflectance is 40% or less for a light beam of 500-1000 nm impinging on the surface at an angle of 5 degree, at a bonded portion formed by raising the temperature of the bonding material to 250°C and then cooling the bonding material down to the room temperature. The bonding material 4 contains a solder component, and particles having a melting point higher than that of the solder component. Since the laser heating method can be used for mounting various electronic components, the degree of freedom can be enhanced in the manufacturing of an electronic device.</abstract><oa>free_for_read</oa></addata></record> |
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| subjects | ALLOYS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS CHEMISTRY CLADDING OR PLATING BY SOLDERING OR WELDING CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY FERROUS OR NON-FERROUS ALLOYS MACHINE TOOLS MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS METAL-WORKING NOT OTHERWISE PROVIDED FOR METALLURGY PERFORMING OPERATIONS PRINTED CIRCUITS SOLDERING OR UNSOLDERING TRANSPORTING TREATMENT OF ALLOYS OR NON-FERROUS METALS WELDING WORKING BY LASER BEAM |
| title | METHOD OF MANUFACTURING ELECTRONIC DEVICE BY LASER HEATING METHOD |
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