ROTARY BLADE VAPOR DEPOSITION EQUIPMENT

PROBLEM TO BE SOLVED: To obtain a structure of equipment satisfying the requirements: in mass production using chemical vapor deposition (CVD) in which a crystal film is deposited on a substrate, a batch size is increased while improving uniformity; a gas flow rate is increased without increasing a...

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Hauptverfasser: TAKEDA MASAYUKI, NISHIZAWA TAKESHI, MURA NAOMI
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creator TAKEDA MASAYUKI
NISHIZAWA TAKESHI
MURA NAOMI
description PROBLEM TO BE SOLVED: To obtain a structure of equipment satisfying the requirements: in mass production using chemical vapor deposition (CVD) in which a crystal film is deposited on a substrate, a batch size is increased while improving uniformity; a gas flow rate is increased without increasing a gas flow amount; and HVPE (Hydride Vapor Phase Epitaxy) can be used as a method other than organic metal CVD which is expensive and consumes a large amount of carry gas.SOLUTION: Rotary blade vapor deposition equipment is provided in which susceptors are arranged like turbine blades, and a substrate is placed on a surface of the susceptor. The rotation of the blades provides high-speed line velocity. The number of wafers which can be processed once (a batch size) can be increased according to the number of the blades. This rotation also functions as an exhaust mechanism to allow the equipment to be downsized at the same time. The introduction of a heating joint for vaporizing solid metal and guiding the vaporized metal remaining at a high temperature allows liquid or solid materials to be used to reduce a manufacturing cost.
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subjects BASIC ELECTRIC ELEMENTS
CHEMICAL SURFACE TREATMENT
CHEMISTRY
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
COATING MATERIAL WITH METALLIC MATERIAL
COATING METALLIC MATERIAL
DIFFUSION TREATMENT OF METALLIC MATERIAL
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL
METALLURGY
SEMICONDUCTOR DEVICES
SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION
title ROTARY BLADE VAPOR DEPOSITION EQUIPMENT
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