INSPECTION DEVICE

PROBLEM TO BE SOLVED: To lessen foreign substances adhered to a semiconductor wafer in a semiconductor surface inspection device as compared to conventional techniques, in a situation where: the diameter of the foreign substances causing problems becomes smaller and therefore further enhancement of...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	MUKAI HIROSHI, WATANABE MASATOSHI, KANDA NOBUHIRO, INAGAKI KATSUYASU, IIJIMA YUICHIRO, SUGIMURA KAZUYUKI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRICITY INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIRCHEMICAL OR PHYSICAL PROPERTIES MEASURING PHYSICS SEMICONDUCTOR DEVICES TESTING
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