METHOD OF MANUFACTURING MULTILAYER WIRING BOARD

PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer wiring board capable of inexpensively manufacturing high quality semiconductor element connection terminals, and thereby capable of enhancing the mounting reliability of the semiconductor element.SOLUTION: A first metal layer 13...

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Bibliographische Detailangaben
1. Verfasser:	YABUTA EIJI
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS SEMICONDUCTOR DEVICES
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