CIRCUIT BOARD AND METHOD FOR MOUNTING CIRCUIT COMPONENT ON SUBSTRATE

PROBLEM TO BE SOLVED: To provide a circuit board which reduces formation materials of a protection layer.SOLUTION: A circuit board 10 of this invention includes: a substrate 11; a fixing member 20 to which the substrate 11 is fixed; a circuit component 12 mounted on a first surface 11a at the fixing...

Ausführliche Beschreibung

Bibliographische Detailangaben

Hauptverfasser:	ARAO OSAMU, NIIOBI AKIRA
Format:	Patent
Sprache:	eng
Schlagworte:	CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ELECTRICITY MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS PRINTED CIRCUITS
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