CIRCUIT BOARD AND METHOD FOR MOUNTING CIRCUIT COMPONENT ON SUBSTRATE

CIRCUIT BOARD AND METHOD FOR MOUNTING CIRCUIT COMPONENT ON SUBSTRATE

PROBLEM TO BE SOLVED: To provide a circuit board which reduces formation materials of a protection layer.SOLUTION: A circuit board 10 of this invention includes: a substrate 11; a fixing member 20 to which the substrate 11 is fixed; a circuit component 12 mounted on a first surface 11a at the fixing...

Ausführliche Beschreibung

Gespeichert in:
Bibliographische Detailangaben
Hauptverfasser: ARAO OSAMU, NIIOBI AKIRA
Format: Patent
Sprache:eng
Schlagworte:
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
Online-Zugang:Volltext bestellen
Tags: Tag hinzufügen
Keine Tags, Fügen Sie den ersten Tag hinzu!
container_end_page
container_issue
container_start_page
container_title
container_volume
creator ARAO OSAMU
NIIOBI AKIRA
description PROBLEM TO BE SOLVED: To provide a circuit board which reduces formation materials of a protection layer.SOLUTION: A circuit board 10 of this invention includes: a substrate 11; a fixing member 20 to which the substrate 11 is fixed; a circuit component 12 mounted on a first surface 11a at the fixing member side in the substrate 11; and a protection film 17 that is selectively provided on the surface 11a at the fixing member side in the substrate 11 so as to cover at least a part of the circuit component 12. A thermal decomposition temperature of the protection film 17 is equal to or higher than 100°C and the protection film 17 is formed by a resin that cures when energy is applied thereto.
format Patent
fullrecord <record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2013183137A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2013183137A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2013183137A3</originalsourceid><addsrcrecordid>eNrjZHBx9gxyDvUMUXDydwxyUXD0c1HwdQ3x8HdRcPMPUvD1D_UL8fRzV4Cpcvb3DfD3c_ULUfD3UwgOdQoOCXIMceVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhsaGFsaGxuaOxkQpAgCtOixA</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>CIRCUIT BOARD AND METHOD FOR MOUNTING CIRCUIT COMPONENT ON SUBSTRATE</title><source>esp@cenet</source><creator>ARAO OSAMU ; NIIOBI AKIRA</creator><creatorcontrib>ARAO OSAMU ; NIIOBI AKIRA</creatorcontrib><description>PROBLEM TO BE SOLVED: To provide a circuit board which reduces formation materials of a protection layer.SOLUTION: A circuit board 10 of this invention includes: a substrate 11; a fixing member 20 to which the substrate 11 is fixed; a circuit component 12 mounted on a first surface 11a at the fixing member side in the substrate 11; and a protection film 17 that is selectively provided on the surface 11a at the fixing member side in the substrate 11 so as to cover at least a part of the circuit component 12. A thermal decomposition temperature of the protection film 17 is equal to or higher than 100°C and the protection film 17 is formed by a resin that cures when energy is applied thereto.</description><language>eng</language><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS ; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR ; ELECTRICITY ; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS ; PRINTED CIRCUITS</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130912&amp;DB=EPODOC&amp;CC=JP&amp;NR=2013183137A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25542,76290</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&amp;date=20130912&amp;DB=EPODOC&amp;CC=JP&amp;NR=2013183137A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>ARAO OSAMU</creatorcontrib><creatorcontrib>NIIOBI AKIRA</creatorcontrib><title>CIRCUIT BOARD AND METHOD FOR MOUNTING CIRCUIT COMPONENT ON SUBSTRATE</title><description>PROBLEM TO BE SOLVED: To provide a circuit board which reduces formation materials of a protection layer.SOLUTION: A circuit board 10 of this invention includes: a substrate 11; a fixing member 20 to which the substrate 11 is fixed; a circuit component 12 mounted on a first surface 11a at the fixing member side in the substrate 11; and a protection film 17 that is selectively provided on the surface 11a at the fixing member side in the substrate 11 so as to cover at least a part of the circuit component 12. A thermal decomposition temperature of the protection film 17 is equal to or higher than 100°C and the protection film 17 is formed by a resin that cures when energy is applied thereto.</description><subject>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</subject><subject>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</subject><subject>ELECTRICITY</subject><subject>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</subject><subject>PRINTED CIRCUITS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZHBx9gxyDvUMUXDydwxyUXD0c1HwdQ3x8HdRcPMPUvD1D_UL8fRzV4Cpcvb3DfD3c_ULUfD3UwgOdQoOCXIMceVhYE1LzClO5YXS3AxKbq4hzh66qQX58anFBYnJqXmpJfFeAUYGhsaGFsaGxuaOxkQpAgCtOixA</recordid><startdate>20130912</startdate><enddate>20130912</enddate><creator>ARAO OSAMU</creator><creator>NIIOBI AKIRA</creator><scope>EVB</scope></search><sort><creationdate>20130912</creationdate><title>CIRCUIT BOARD AND METHOD FOR MOUNTING CIRCUIT COMPONENT ON SUBSTRATE</title><author>ARAO OSAMU ; NIIOBI AKIRA</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2013183137A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS</topic><topic>ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR</topic><topic>ELECTRICITY</topic><topic>MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS</topic><topic>PRINTED CIRCUITS</topic><toplevel>online_resources</toplevel><creatorcontrib>ARAO OSAMU</creatorcontrib><creatorcontrib>NIIOBI AKIRA</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>ARAO OSAMU</au><au>NIIOBI AKIRA</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>CIRCUIT BOARD AND METHOD FOR MOUNTING CIRCUIT COMPONENT ON SUBSTRATE</title><date>2013-09-12</date><risdate>2013</risdate><abstract>PROBLEM TO BE SOLVED: To provide a circuit board which reduces formation materials of a protection layer.SOLUTION: A circuit board 10 of this invention includes: a substrate 11; a fixing member 20 to which the substrate 11 is fixed; a circuit component 12 mounted on a first surface 11a at the fixing member side in the substrate 11; and a protection film 17 that is selectively provided on the surface 11a at the fixing member side in the substrate 11 so as to cover at least a part of the circuit component 12. A thermal decomposition temperature of the protection film 17 is equal to or higher than 100°C and the protection film 17 is formed by a resin that cures when energy is applied thereto.</abstract><oa>free_for_read</oa></addata></record>
fulltext fulltext_linktorsrc
identifier
ispartof
issn
language eng
recordid cdi_epo_espacenet_JP2013183137A
source esp@cenet
subjects CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
title CIRCUIT BOARD AND METHOD FOR MOUNTING CIRCUIT COMPONENT ON SUBSTRATE
url https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-02-02T04%3A13%3A07IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=ARAO%20OSAMU&rft.date=2013-09-12&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2013183137A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true