CURABLE RESIN COMPOSITION

PROBLEM TO BE SOLVED: To provide a curable resin composition, which can be used for a substrate having inferior heat resistance and which has no solvent selectivity.SOLUTION: A curable resin composition includes: an acrylic polymer (A) prepared by polymerizing an acrylic ester (a) having a hydroxyl...

Ausführliche Beschreibung

Gespeichert in:

Bibliographische Detailangaben
Hauptverfasser:	YANAI HIROYUKI, MIKAMI JOSHI
Format:	Patent
Sprache:	eng
Schlagworte:	CHEMISTRY COMPOSITIONS BASED THEREON COMPOSITIONS OF MACROMOLECULAR COMPOUNDS METALLURGY ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-UP USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS
Online-Zugang:	Volltext bestellen
Tags:	Tag hinzufügen Keine Tags, Fügen Sie den ersten Tag hinzu!

Beschreibung
Zusammenfassung:	PROBLEM TO BE SOLVED: To provide a curable resin composition, which can be used for a substrate having inferior heat resistance and which has no solvent selectivity.SOLUTION: A curable resin composition includes: an acrylic polymer (A) prepared by polymerizing an acrylic ester (a) having a hydroxyl group as a structural component by 30% or more; and a basic compound (B) having a heterocyclic ring including nitrogen.