WIRE AND COIL

PROBLEM TO BE SOLVED: To reduce loss in a DC superimposed high frequency circuit, a low frequency superimposed high frequency circuit, and the like.SOLUTION: Copper wires each having a magnetic plating layer formed on the surface are mixed and aggregated to obtain a wire. Since magnetic material pla...

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Hauptverfasser:	KO YOSHIO, MARUYAMA KAZUMASA, IKEDA CHISATO
Format:	Patent
Sprache:	eng
Schlagworte:	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INDUCTANCES INSULATORS MAGNETS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES TRANSFORMERS
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creator	KO YOSHIO MARUYAMA KAZUMASA IKEDA CHISATO
description	PROBLEM TO BE SOLVED: To reduce loss in a DC superimposed high frequency circuit, a low frequency superimposed high frequency circuit, and the like.SOLUTION: Copper wires each having a magnetic plating layer formed on the surface are mixed and aggregated to obtain a wire. Since magnetic material plated copper wires are disposed, DC resistance or low frequency resistance can be reduced. Since a magnetic field produced by a flowing current is interrupted by the magnetic material plating layer and does not enter the copper wire part easily, increase in copper loss due to proximity effect at high frequency can be suppressed. Consequently, loss can be reduced in a DC superimposed high frequency circuit, a low frequency superimposed high frequency circuit, and the like.
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fullrecord	<record><control><sourceid>epo_EVB</sourceid><recordid>TN_cdi_epo_espacenet_JP2013168385A</recordid><sourceformat>XML</sourceformat><sourcesystem>PC</sourcesystem><sourcerecordid>JP2013168385A</sourcerecordid><originalsourceid>FETCH-epo_espacenet_JP2013168385A3</originalsourceid><addsrcrecordid>eNrjZOAN9wxyVXD0c1Fw9vf04WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaGxoZmFsYWpo7GRCkCAMyCHOM</addsrcrecordid><sourcetype>Open Access Repository</sourcetype><iscdi>true</iscdi><recordtype>patent</recordtype></control><display><type>patent</type><title>WIRE AND COIL</title><source>esp@cenet</source><creator>KO YOSHIO ; MARUYAMA KAZUMASA ; IKEDA CHISATO</creator><creatorcontrib>KO YOSHIO ; MARUYAMA KAZUMASA ; IKEDA CHISATO</creatorcontrib><description>PROBLEM TO BE SOLVED: To reduce loss in a DC superimposed high frequency circuit, a low frequency superimposed high frequency circuit, and the like.SOLUTION: Copper wires each having a magnetic plating layer formed on the surface are mixed and aggregated to obtain a wire. Since magnetic material plated copper wires are disposed, DC resistance or low frequency resistance can be reduced. Since a magnetic field produced by a flowing current is interrupted by the magnetic material plating layer and does not enter the copper wire part easily, increase in copper loss due to proximity effect at high frequency can be suppressed. Consequently, loss can be reduced in a DC superimposed high frequency circuit, a low frequency superimposed high frequency circuit, and the like.</description><language>eng</language><subject>BASIC ELECTRIC ELEMENTS ; CABLES ; CONDUCTORS ; ELECTRICITY ; INDUCTANCES ; INSULATORS ; MAGNETS ; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES ; SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES ; TRANSFORMERS</subject><creationdate>2013</creationdate><oa>free_for_read</oa><woscitedreferencessubscribed>false</woscitedreferencessubscribed></display><links><openurl>$$Topenurl_article</openurl><openurlfulltext>$$Topenurlfull_article</openurlfulltext><thumbnail>$$Tsyndetics_thumb_exl</thumbnail><linktohtml>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130829&DB=EPODOC&CC=JP&NR=2013168385A$$EHTML$$P50$$Gepo$$Hfree_for_read</linktohtml><link.rule.ids>230,308,776,881,25543,76293</link.rule.ids><linktorsrc>$$Uhttps://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20130829&DB=EPODOC&CC=JP&NR=2013168385A$$EView_record_in_European_Patent_Office$$FView_record_in_$$GEuropean_Patent_Office$$Hfree_for_read</linktorsrc></links><search><creatorcontrib>KO YOSHIO</creatorcontrib><creatorcontrib>MARUYAMA KAZUMASA</creatorcontrib><creatorcontrib>IKEDA CHISATO</creatorcontrib><title>WIRE AND COIL</title><description>PROBLEM TO BE SOLVED: To reduce loss in a DC superimposed high frequency circuit, a low frequency superimposed high frequency circuit, and the like.SOLUTION: Copper wires each having a magnetic plating layer formed on the surface are mixed and aggregated to obtain a wire. Since magnetic material plated copper wires are disposed, DC resistance or low frequency resistance can be reduced. Since a magnetic field produced by a flowing current is interrupted by the magnetic material plating layer and does not enter the copper wire part easily, increase in copper loss due to proximity effect at high frequency can be suppressed. Consequently, loss can be reduced in a DC superimposed high frequency circuit, a low frequency superimposed high frequency circuit, and the like.</description><subject>BASIC ELECTRIC ELEMENTS</subject><subject>CABLES</subject><subject>CONDUCTORS</subject><subject>ELECTRICITY</subject><subject>INDUCTANCES</subject><subject>INSULATORS</subject><subject>MAGNETS</subject><subject>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</subject><subject>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</subject><subject>TRANSFORMERS</subject><fulltext>true</fulltext><rsrctype>patent</rsrctype><creationdate>2013</creationdate><recordtype>patent</recordtype><sourceid>EVB</sourceid><recordid>eNrjZOAN9wxyVXD0c1Fw9vf04WFgTUvMKU7lhdLcDEpuriHOHrqpBfnxqcUFicmpeakl8V4BRgaGxoZmFsYWpo7GRCkCAMyCHOM</recordid><startdate>20130829</startdate><enddate>20130829</enddate><creator>KO YOSHIO</creator><creator>MARUYAMA KAZUMASA</creator><creator>IKEDA CHISATO</creator><scope>EVB</scope></search><sort><creationdate>20130829</creationdate><title>WIRE AND COIL</title><author>KO YOSHIO ; MARUYAMA KAZUMASA ; IKEDA CHISATO</author></sort><facets><frbrtype>5</frbrtype><frbrgroupid>cdi_FETCH-epo_espacenet_JP2013168385A3</frbrgroupid><rsrctype>patents</rsrctype><prefilter>patents</prefilter><language>eng</language><creationdate>2013</creationdate><topic>BASIC ELECTRIC ELEMENTS</topic><topic>CABLES</topic><topic>CONDUCTORS</topic><topic>ELECTRICITY</topic><topic>INDUCTANCES</topic><topic>INSULATORS</topic><topic>MAGNETS</topic><topic>SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES</topic><topic>SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES</topic><topic>TRANSFORMERS</topic><toplevel>online_resources</toplevel><creatorcontrib>KO YOSHIO</creatorcontrib><creatorcontrib>MARUYAMA KAZUMASA</creatorcontrib><creatorcontrib>IKEDA CHISATO</creatorcontrib><collection>esp@cenet</collection></facets><delivery><delcategory>Remote Search Resource</delcategory><fulltext>fulltext_linktorsrc</fulltext></delivery><addata><au>KO YOSHIO</au><au>MARUYAMA KAZUMASA</au><au>IKEDA CHISATO</au><format>patent</format><genre>patent</genre><ristype>GEN</ristype><title>WIRE AND COIL</title><date>2013-08-29</date><risdate>2013</risdate><abstract>PROBLEM TO BE SOLVED: To reduce loss in a DC superimposed high frequency circuit, a low frequency superimposed high frequency circuit, and the like.SOLUTION: Copper wires each having a magnetic plating layer formed on the surface are mixed and aggregated to obtain a wire. Since magnetic material plated copper wires are disposed, DC resistance or low frequency resistance can be reduced. Since a magnetic field produced by a flowing current is interrupted by the magnetic material plating layer and does not enter the copper wire part easily, increase in copper loss due to proximity effect at high frequency can be suppressed. Consequently, loss can be reduced in a DC superimposed high frequency circuit, a low frequency superimposed high frequency circuit, and the like.</abstract><oa>free_for_read</oa></addata></record>
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subjects	BASIC ELECTRIC ELEMENTS CABLES CONDUCTORS ELECTRICITY INDUCTANCES INSULATORS MAGNETS SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES SELECTION OF MATERIALS FOR THEIR MAGNETIC PROPERTIES TRANSFORMERS
title	WIRE AND COIL
url	https://sfx.bib-bvb.de/sfx_tum?ctx_ver=Z39.88-2004&ctx_enc=info:ofi/enc:UTF-8&ctx_tim=2025-01-24T20%3A23%3A25IST&url_ver=Z39.88-2004&url_ctx_fmt=infofi/fmt:kev:mtx:ctx&rfr_id=info:sid/primo.exlibrisgroup.com:primo3-Article-epo_EVB&rft_val_fmt=info:ofi/fmt:kev:mtx:patent&rft.genre=patent&rft.au=KO%20YOSHIO&rft.date=2013-08-29&rft_id=info:doi/&rft_dat=%3Cepo_EVB%3EJP2013168385A%3C/epo_EVB%3E%3Curl%3E%3C/url%3E&disable_directlink=true&sfx.directlink=off&sfx.report_link=0&rft_id=info:oai/&rft_id=info:pmid/&rfr_iscdi=true