SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF THE SAME

PROBLEM TO BE SOLVED: To provide a semiconductor device which achieves downsizing by forming a plurality of semiconductor chips into a vertically-stacked structure; and to provide a semiconductor device manufacturing method in which the number of manufacturing processes is significantly reduced.SOLUTION: A semiconductor device comprises: a semiconductor element 2; a support substrate 1; an insulating material layer 4 for encapsulating the semiconductor element 2 and surroundings of the semiconductor element 2; a metal thin film wiring layer 6 provided in the insulating material layer 4 and a part of which is exposed on an outer surface; and a metal via 9 provided in the insulating material layer 4 and electrically connected to the metal thin film wiring layer 6. There is a plurality of numbers of semiconductor elements 2. Each semiconductor element 2 is stacked via an insulating material such that a circuit surface faces the metal thin film wiring layer 6 side. Electrode pads of each semiconductor element 2 are exposed without being shielded by another semiconductor element stacked thereon and electrically connected with the metal thin film wiring layer.