SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

PROBLEM TO BE SOLVED: To provide a semiconductor device which makes an overall package height after the lamination of BGA packages low and places a connection portion of the upper and lower BGA packages at a low position thereby allowing an operator to easily pour a reinforcement resin.SOLUTION: In...

Ausführliche Beschreibung

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Bibliographische Detailangaben
1. Verfasser: FURUSAWA KOJI
Format: Patent
Sprache:eng
Schlagworte:
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Beschreibung
Zusammenfassung:PROBLEM TO BE SOLVED: To provide a semiconductor device which makes an overall package height after the lamination of BGA packages low and places a connection portion of the upper and lower BGA packages at a low position thereby allowing an operator to easily pour a reinforcement resin.SOLUTION: In a semiconductor device formed by laminating packages 10 and 20 respectively having solder ball terminals, solder ball terminals 24 of the upper package 20 are connected with a side surface electrode 15 of the lower package 10 and a bottom surface of the upper package is in contact with a top surface of the lower package.